Robust Ultralow-$k$ Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition von Kikuchi, Yoshiyuki, Miyatani, Kotaro, Kobayashi, Yasuo, Kawamura, Kohei, Nemoto, Takenao, Nakamura, Masahiro, Matsumoto, Hirokazu, Ito, Azumi, Shirotori, Akihide, Nozawa, Toshihisa, Matsuoka, Takaaki

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Electrical Characteristics of Novel Non-porous Low-$k$ Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond von Gu, Xun, Nemoto, Takenao, Tomita, Yugo, Shirotori, Akihide, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroki, Shin-Ichiro, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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Robust Ultralow- k Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition von Kikuchi, Yoshiyuki, Miyatani, Kotaro, Kobayashi, Yasuo, Kawamura, Kohei, Nemoto, Takenao, Nakamura, Masahiro, Matsumoto, Hirokazu, Ito, Azumi, Shirotori, Akihide, Nozawa, Toshihisa, Matsuoka, Takaaki

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Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-$k$ Dielectric Fluorocarbon on Advanced Cu Interconnects von Gu, Xun, Tomita, Yugo, Nemoto, Takenao, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroda, Rihito, Kuroki, Shin-Ichiro, Kawase, Kazumasa, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow- k Dielectric Fluorocarbon on Advanced Cu Interconnects von Gu, Xun, Tomita, Yugo, Nemoto, Takenao, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroda, Rihito, Kuroki, Shin-Ichiro, Kawase, Kazumasa, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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Electrical Characteristics of Novel Non-porous Low- k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond von Gu, Xun, Nemoto, Takenao, Tomita, Yugo, Shirotori, Akihide, Miyatani, Kotaro, Saito, Akane, Kobayashi, Yasuo, Teramoto, Akinobu, Kuroki, Shin-Ichiro, Nozawa, Toshihisa, Matsuoka, Takaaki, Sugawa, Shigetoshi, Ohmi, Tadahiro

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FILM FORMING METHOD AND FILM FORMING APPARATUS von KARAKAWA, Takayuki, HARADA, Katsushige, MOROZUMI, Yuichiro, NAKAMURA, Hideo, MIYATANI, Kotaro

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Deposition of diamond-like carbon film in CH4-He r.f. plasma von MUTSUKURA, N, MIYATANI, K

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FILM-FORMING METHOD, FILM-FORMING APPARATUS, AND OXIDATION METHOD von NORO, Naotaka, IKEUCHI, Toshiyuki, SHIMOMURA, Kouji, SHIMAMOTO, Ryoun, HONG, Younggi, MIYATANI, Kotaro

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR von MIYATANI, KOTARO

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Film Forming and Cleaning Method von MIYATANI KOTARO

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR von MIYATANI, KOTARO

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Surface treatment method von Kobayashi, Yasuo, Maekawa, Kaoru, Miyatani, Kotaro

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FILM FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE von Miyatani Kotaro, Kawamura Kohei, Kurotori Takuya

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Method of forming film and apparatus of forming film von MIYATANI, KOTARO, HARADA, KATSUSHIGE, NAKAMURA, HIDEO, MOROZUMI, YUICHIRO, KARAKAWA, TAKAYUKI

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FILM-FORMING AND CLEANING METHOD von MIYATANI KOTARO

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METHOD OF FORMING FILM AND APPARATUS OF FORMING FILM von MIYATANI KOTARO, NAKAMURA HIDEO, KARAKAWA TAKAYUKI, HARADA TAKESHIGE, MOROZUMI YUICHIRO

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FILM FORMING METHOD AND FILM FORMING APPARATUS von MIYATANI KOTARO, NAKAMURA HIDEO, KARAKAWA TAKAYUKI, MOROZUMI YUICHIRO, HARADA KATSUSHIGE

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CLEANING METHOD, COMPUTER PROGRAM AND FILM DEPOSITING DEVICE von MIYATANI KOTARO

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SEMICONDUCTOR DEVICE MANUFACTURING METHOD von MIYATANI KOTARO, KUROTORI TAKUYA, ISHIZAKA TADAHIRO

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