Three Pounds and Seven Ounces: My Patient Activation Journey von Mirpuri, Karan K.

Volltext

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy von Xie, H.X., Friedman, D., Mirpuri, K., Chawla, N.

Volltext

ECMO Survivors' Reflections on Their ICU Experience and Recovery von Hendrickson, Elizabeth, Mirpuri, Karan K, Kolmar, Amanda

Volltext

Understanding and preventing Cu–Sn micro joint defects through design and process control von Njuki, M., Thekkut, S., Das, R., Shahane, N., Thompson, P., Mirpuri, K., Borgesen, P., Dimitrov, N.

Volltext

Salivary testosterone in male and female youth with and without autism spectrum disorder: considerations of development, sex, and diagnosis von Muscatello, Rachael A, Rafatjoo, Emma, Mirpuri, Karan K, Kim, Ahra, Vandekar, Simon, Corbett, Blythe A

Volltext

Mixing viscoplastic fluids in stirred vessels over multiple scales: A combined experimental and CFD approach von Russell, Andrew W., Kahouadji, Lyes, Mirpuri, Karan, Quarmby, Andrew, Piccione, Patrick M., Matar, Omar K., Luckham, Paul F., Markides, Christos N.

Volltext

Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction von Mirpuri, K., Wendrock, H., Menzel, S., Wetzig, K., Szpunar, J.

Volltext

Enhanced voiding in Cu-Sn micro joints von Njuki, M., Thekkut, S., Sivasubramony, R., Greene, C.M., Shahane, N., Thompson, P., Mirpuri, K., Borgesen, P., Dimitrov, N.

Volltext

High temperature behavior of Cu films studied in-situ by Electron Backscatter Diffraction von Mirpuri, K., Wendrock, H., Menzel, S., Wetzig, K., Szpunar, J.

Volltext

Texture investigation of copper interconnects with a different line width von CHO, J.-Y, MIRPURI, K, LEE, D. N, AN, J.-K, SZPUNAR, J. A

Volltext

Mixing viscoplastic fluids in stirred vessels over multiple scales: An experimental and CFD approach von Russell, AW, Kahouadji, L, Mirpuri, K, Quarmby, A, Piccione, PM, Matar, OK, Luckham, PF, Markides, CN

Volltext

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy : LEAD-FREE... von XIE, H. X, FRIEDMAN, D, MIRPURI, K, CHAWLA, N

Volltext

Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects von Mirpuri, Kabirkumar, Szpunar, Jerzy

Volltext

Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines von Mirpuri, Kabirkumar, Szpunar, Jerzy

Volltext

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure von Wendrock, Horst, Mirpuri, Kabir, Menzel, Siegfried, Schindler, Günther, Wetzig, Klaus

Volltext

Texture, microstructure and stress investigations in 0.18 mm damascene Cu interconnect lines von Mirpuri, K, Cho, J-Y, Szpunar, J

Volltext

Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction von Mirpuri, Kabirkumar J, Szpunar, Jerzy A

Volltext

Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines von Mirpuri, Kabir Kumar, Szpunar, Jerzy A., Cho, Jae Young

Volltext

Behavior of (1 1 1) grains during the thermal treatment of copper film studied in situ by electron back-scatter diffraction von Mirpuri, Kabir-kumar, Wendrock, Horst, Wetzig, Klaus, Szpunar, Jerzy

Volltext

Superposition of grain size and dispersion strengthening in ODS L1(2)-(Al5Cr)3Ti von Heilmaier, M, Saage, H, Mirpuri, K J, Eckert, J, Schultz, L, Singh, P

Volltext