Design and Characterization of Taper Coupler for Effective Laser and Single-Mode Fiber Coupling With Large Tolerance von Zhang Jing, Ramana, P.V., Hon-Shing, J.L., Zhang Qingxin, Chandrappan, J., Tan Chee Wei, Jong Ming Chinq, Liang, C., Kwong Dim Lee

Volltext

Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain von Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang

Volltext

Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor von Kumar, A, Xiaowu Zhang, Qing Xin Zhang, Ming Chinq Jong, Guanbo Huang, Vincent, L W S, Kripesh, V, Lee, C, Lau, J H, Dim Lee Kwong, Sundaram, V, Tummula, R R, Meyer-Berg, G

Volltext

1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics von Li, Xin, Gourikutty, Sajay Bhuvanendran Nair, Wu, Jiaqi, Lim, Teck Guan, Guo, Pengfei, Davies, Jaye Charles, Koh, Edward Sing Chee, Lau, Boon Long, Jong, Ming Chinq, Chong, Ser Choong, Sandra, San, Li, Chao, Lo, Guo-Qiang, Bhattacharya, Surya, Liow, Jason Tsung-Yang

Volltext

Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package von Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun

Volltext

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink von Feng, Huicheng, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Jong, Ming Chinq, Au, Keng Yuen Jason, Ong, Jun Wei Javier, Chui, King Jien, Li, Jun, Li, Hongying, Vinh Le, Duc, Lou, Jing

Volltext

Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer von Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

Volltext bestellen

Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level von Hoe, Yen Yi Germaine, Gongyue, Tang, Sharma, Gaurav, Pinjala, Damaragunath, Rao, Vempati Srinivasa, Chinq, Jong Ming, Siang, Sharon Lim Pei, Kumar, Aditya, Wee, Ho Soon, Xiaowu, Zhang, Kripesh, V.

Volltext bestellen

A method for removing vinylidene chloride from 1,1-dichloro-1-fluoroethane by photochlorination von CHEN, BOR-MING, YANG, JONG-DENG, SHIEH, CHERNG-JIIN, LIOU, WEY-JONG, CHEN, CHINQ-YUN

Volltext bestellen