Substrate Transfer: an Enabling Technology for System-in-Package Solutions von Dekker, R., Dumling, M., Fock, J.-H., Haartsen, J.R., Maas, H.G.R., Michielsen, T.M., Pohlmann, H., Schnitt, W., Tombeur, A.M.H.

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A 10 /spl mu/m thick RF-ID tag for chip-in-paper applications von Dekker, R., Dumling, M., Fock, J.-H., Gourhant, O., Jonville, C., Michielsen, T.M., Pohlmann, H., Schnitt, W., Tombeur, A.M.H.

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Substrate transfer: enabling technology for RF applications von Dekker, R., Dessein, K., Fock, J.-H., Gakis, A., Jonville, C., Kuijken, O.M., Michielsen, T.M., Mijlemans, P., Pohlmann, H., Schnitt, W., Timmering, C.E., Tombeur, A.M.H.

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Surface-related phenomena in the direct bonding of silicon and fused-silica wafer pairs von Spierings, G.A.C.M., Haisma, J., Michelsen, T.M.

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