Robust semiconductor-on-ferroelectric structures with hafnia-zirconia-alumina UTBOX stacks compatible with CMOS technology von Popov, V. P., Antonov, V. A., Tikhonenko, F., Tarkov, S. M., Gutakovskii, A. K., Tyschenko, I. E., Miakonkikh, A., Lomov, A. A., Rogozhin, A. E., Rudenko, K.

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Low-Pressure Inductively Coupled CF3Br Plasma Studied by the Langmuir Probe and Optical Emission Spectroscopy Techniques von Kuzmenko, V. O., Miakonkikh, A. V.

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Dielectric permittivity of organosilicate glass thin films on a sapphire substrate determined using time-domain THz and Fourier IR spectroscopy von Komandin, G A, Nozdrin, V S, Chernomyrdin, N V, Seregin, D S, Vishnevskiy, A S, Kurlov, V N, Vorotilov, K A, Miakonkikh, A V, Lomov, A A, Rudenko, K V, Spektor, I E

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Optimization of deep silicon etching process for microstructures fabrication von Kuzmenko, V, Miakonkikh, A, Rudenko, K

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Tuning electrical properties in Ga2O3 polymorphs induced with ion beams von Polyakov, A. Y., Kochkova, А. I., Azarov, A., Venkatachalapathy, V., Miakonkikh, A. V., Vasilev, A. A., Chernykh, A. V., Shchemerov, I. V., Romanov, A. A., Kuznetsov, A., Pearton, S. J.

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Application of Spectral Ellipsometry for Dielectric, Metal, and Semiconductor Films in Microelectronics Technology von Gaidukasov, R. A., Miakonkikh, A. V.

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Investigation of Gas Condensation in Pores of Nanoporous Dielectrics in Cryogenic Etching Conditions von Gaidukasov, R. A., Miakonkikh, A. V.

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Ruthenium for Subtractive and Semi-Damascene Processes of Interconnects Formation von Rogozhin, A., Miakonkikh, A., Rudenko, K.

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Technological Approaches for Formation of High-Density Integral Capacitors: Deep Etching and Atomic Layer Deposition von Miakonkikh, A., Pankratov, S., Kuzmenko, V., Rudenko, K.

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Application of Langmuir probe and optical emission spectroscopy for bromofluorocarbon plasma diagnostics von Kuzmenko, V, Miakonkikh, A, Rudenko, K

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Measurement of the gas temperature of neutrals in reactive plasmas by moderate-resolution OES von Miakonkikh, A.V., Rudenko, K.V.

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Investigation of Fluorocarbon Film Deposition from Ar/CF4/H2 Plasma for the Implementation of the Atomic Layer Etching Process von Kuzmenko, V. O., Miakonkikh, A. V., Rudenko, K. V.

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Cryo Plasma Etching of Porous Low-k Dielectrics von Miakonkikh, A. V., Kuzmenko, V. O., Rudenko, K. V.

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Excitation of localized graphene plasmons by aperiodic self-assembled arrays of metallic antennas von Kaydashev, V, Khlebtsov, B, Miakonkikh, A, Zhukova, E, Zhukov, S, Mylnikov, D, Domaratskiy, I, Svintsov, D

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Ferroelectric properties of SOS and SOI pseudo-MOSFETs with HfO2 interlayers von Popov, V.P., Antonov, V.A., Ilnitsky, M.A., Tyschenko, I.E., Vdovin, V.I., Miakonkikh, A.V., Rudenko, K.V.

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Low-k protection from F radicals and VUV photons using a multilayer pore grafting approach von Zotovich, A, Rezvanov, A, Chanson, R, Zhang, L, Hacker, N, Kurchikov, K, Klimin, S, Zyryanov, S M, Lopaev, D, Gornev, E, Clemente, I, Miakonkikh, A, Maslakov, K

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Atomic layer etching of Silicon Oxide von Kuzmenko, V., Miakonkikh, A., Rudenko, K.

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The effects of hydrogenation on the properties of heavy ion irradiated β-Ga2O3 von Polyakov, A. Y., Kuznetsov, A., Azarov, A., Miakonkikh, A. V., Chernykh, A. V., Vasilev, A. A., Shchemerov, I. V., Kochkova, A. I., Matros, N. R., Pearton, S. J.

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Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2 von Smirnova, E A, Miakonkikh, A V, Rogozhin, A E, Rudenko, K V

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Parameters and Composition of Plasma in a CF4 + H2 + Ar Mixture: Effect of CF4/H2 Ratio von Miakonkikh, A. V., Kuzmenko, V. O., Efremov, A. M., Rudenko, K. V.

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