In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration von Ayoub, Bassel, Moreau, Stéphane, Lhostis, Sandrine, Frémont, Hélène, Mermoz, Sébastien, Souchier, Emeline, Deloffre, Emilie, Escoubas, Stéphanie, Cornelius, Thomas W., Thomas, Olivier

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Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force von Berthier, Jean, Mermoz, Sébastien, Brakke, Kenneth, Sanchez, Loic, Frétigny, Christian, Cioccio, Léa Di

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(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations von Deloffre, Emilie, Ayoub, Bassel, Lhostis, Sandrine, Dettoni, Florent, Fournel, Frank, Montméat, Pierre, Mermoz, Sebastien

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Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm von Lhostis, S., Ayoub, B., Sart, C., Moreau, S., Souchier, E., Gusmao Cacho, M. G., Deloffre, E., Mermoz, S., Rey, C., Le Roux, F., Aybeke, E., Gallois-Garreignot, S., Frémont, H., Tournier, A.

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Self-alignment of Silicon Chips on Wafers: a Numerical Investigation of the Effect of Spreading and Wetting von Berthier, Jean, Brakke, Kenneth, Mermoz, Sébastien, Sanchez, Loïc, Fretigny, Christian, Di Cioccio, Léa

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METHOD COMPRISING PRODUCING AT LEAST ONE ASSEMBLY PAD ON A SUPPORT AND SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT WITH FORMATION OF A FLUOROCARBON MATERIAL SURROUND... von DI CIOCCIO, Léa, MERMOZ, Sébastien, SANCHEZ, Loïc

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Auto-assemblage assisté par capillarité et collage direct von Mermoz, Sebastien

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(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations von Deloffre, Emilie, Ayoub, Bassel, Lhostis, Sandrine, Dettoni, Florent, Fournel, Frank, Montméat, Pierre, Mermoz, Sebastien

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METHOD OF FABRICATING AN ELECTRONIC DEVICE von DELOFFRE, Emilie, MERMOZ, Sebastien, LHOSTIS, Sandrine

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ASSEMBLAGE DE PLAQUES DE CIRCUITS INTÉGRÉS von JEANJEAN, Damien, DE BUTTET, Come, MERMOZ, Sébastien, NEYENS, Marc

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Support for capillary self-assembly with horizontal stabilisation, manufacturing method and use von BERTHIER, JEAN, MERMOZ, SÉBASTIEN, DI CIOCCIO, LÉA

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ASSEMBLY OF INTEGRATED CIRCUIT WAFERS von De Buttet, Come, Jeanjean, Damien, Neyens, Marc, Mermoz, Sebastien

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Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surroundin... von MERMOZ SÉBASTIEN, SANCHEZ LOÏC, DI CIOCCIO LÉA

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METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDIN... von MERMOZ SÉBASTIEN, SANCHEZ LOÏC, DI CIOCCIO LÉA

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Support for capillary self-assembly with horizontal stabilisation, manufacturing method and use von BERTHIER, JEAN, MERMOZ, SÉBASTIEN, DI CIOCCIO, LÉA

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METHOD COMPRISING PRODUCING AT LEAST ONE ASSEMBLY PAD ON A SUPPORT AND SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT WITH FORMATION OF A FLUOROCARBON MATERIAL SURROUND... von DI CIOCCIO, Léa, MERMOZ, Sébastien, SANCHEZ, Loïc

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Procédé de fabrication d'un dispositif électronique von DELOFFRE, Emilie, MERMOZ, Sebastien, LHOSTIS, Sandrine

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Support for capillary self-assembly with horizontal stabilisation, fabrication method and use von Mermoz Sebastien, Di Cioccio Lea, Berthier Jean

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SUPPORT FOR CAPILLARY SELF-ASSEMBLY USING HORIZONTAL STABILIZATION, FABRICATION METHOD AND USE OF THE SAME von SEBASTIEN MERMOZ, LEACIOCCIO, JEAN BERTHIER

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Support for capillary self-assembly with horizontal stabilisation, manufacturing method and use von BERTHIER, JEAN, MERMOZ, SÉBASTIEN, DI CIOCCIO, LÉA

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