Investigation of transient thermal dissipation in thinned LSI for advanced packaging von Araga, Yuuki, Shimamoto, Haruo, Melamed, Samson, Kikuchi, Katsuya, Aoyagi, Masahiro

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Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits von Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro

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Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits von Melamed, Samson, Watanabe, Naoya, Nemoto, Shunsuke, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro

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Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit von Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro

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Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits von Melamed, Samson, Watanabe, Naoya, Nemoto, Shunsuke, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro

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Exploring compromises among timing, power and temperature in three-dimensional integrated circuits von Hua, Hao, Mineo, Chris, Schoenfliess, Kory, Sule, Ambarish, Melamed, Samson, Jenkal, Ravi, Davis, W. Rhett

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Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring von Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., Davis, W. R.

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3 次元IC 積層実装技術の実用化への取り組み: 基盤技術から実用技術へどのようにしてステップアップするのか von 青柳, 昌宏, 居村, 史人, 加藤, 史樹, 菊地, 克弥, 渡辺, 直也, 鈴木, 基史, 仲川, 博, 岡田, 義邦, 横島, 時彦, 山地, 泰弘, 根本, 俊介, Thanh, TUNG Bui, Melamed, SAMSON

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Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration von Thorolfsson, Thorlindur, Melamed, Samson, Davis, W. Rhett, Franzon, Paul D.

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Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration von Thorolfsson, Thorlindur, Melamed, Samson, Davis, W Rhett, Franzon, Paul D

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Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology von AOYAGI, Masahiro, IMURA, Fumito, KATO, Fumiki, KIKUCHI, Katsuya, WATANABE, Naoya, SUZUKI, Motohiro, NAKAGAWA, Hiroshi, OKADA, Yoshikuni, YOKOSHIMA, Tokihiko, YAMAJI, Yasuhiro, NEMOTO, Shunsuke, TUNG, Bui Thanh, SAMSON, Melamed

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Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology von AOYAGI, Masahiro, IMURA, Fumito, KATO, Fumiki, KIKUCHI, Katsuya, WATANABE, Naoya, SUZUKI, Motohiro, NAKAGAWA, Hiroshi, OKADA, Yoshikuni, YOKOSHIMA, Tokihiko, YAMAJI, Yasuhiro, NEMOTO, Shunsuke, BUI, Tung Thanh, MELAMED, Samson

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A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits von Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., Kriplani, N. M., Davis, W. R., Franzon, P. D., Steer, M. B.

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3次元IC 積層実装技術の実用化への取り組み: 基盤技術から実用技術へどのようにしてステップアップするのか von 青柳, 昌宏, 居村, 史人, 加藤, 史樹, 菊地, 克弥, 渡辺, 直也, 鈴木, 基史, 仲川, 博, 岡田, 義邦, 横島, 時彦, 山地, 泰弘, 根本, 俊介, Thanh, BUI Tung, Samson, MELAMED

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3D Specific Systems: Design and CAD von Franzon, P. D., Davis, W. R., Thorolfsson, T., Melamed, S.

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Inter-die signaling in three dimensional integrated circuits von Mineo, C., Jenkal, R., Melamed, S., Davis, W.R.

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Thermal analysis and verification of a mounted monolithic integrated circuit von Harris, T Robert, Melamed, Samson, Luniya, Sonali, Davis, W Rhett, Steer, Michael B, Doxsee, Lawrence E, Obermiller, Kurt, Hawkinson, Chad

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Design and CAD for 3D integrated circuits von Franzon, Paul D., Davis, W. Rhett, Steer, Michael B., Lipa, Steve, Oh, Eun Chu, Thorolfsson, Thor, Melamed, Samson, Luniya, Sonali, Doxsee, Tad, Berkeley, Stephen, Shani, Ben, Obermiller, Kurt

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Compact Electrothermal Modeling of an X-band MMIC von Luniya, S., Batty, W., Caccamesi, V., Garcia, M., Christoffersen, C., Melamed, S., Rhett Davis, W., Steer, M.

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Creating 3D specific systems: Architecture, Design and CAD von Franzon, Paul D., Davis, W. Rhett, Thorolfsson, Thor, Melamed, Samson

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