Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl von Medgyes, Bálint

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Electrochemical corrosion and electrochemical migration characteristics of SAC-1Bi-xMn solder alloys in NaCl solution von Medgyes, Bálint, Gharaibeh, Ali, Harsányi, Gábor, Pécz, Béla, Felhősi, Ilona

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Electrochemical migration of Sn and Sn solder alloys: a review von Zhong, Xiankang, Chen, Longjun, Medgyes, Bálint, Zhang, Zhi, Gao, Shujun, Jakab, László

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Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys von Li, Feng, Verdingovas, Vadimas, Dirscherl, Kai, Harsányi, Gábor, Medgyes, Bálint, Ambat, Rajan

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Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation von Illés, Balázs, Medgyes, Bálint, Dušek, Karel, Bušek, David, Skwarek, Agata, Géczy, Attila

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On the Electrochemical Migration Mechanism of Gold in Electronics-Less Reliable Than Expected? von Medgyes, Balint, Gharaibeh, Ali, Rigler, Daniel, Harsanyi, Gabor

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Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers von Illés, Balázs, Hurtony, Tamás, Medgyes, Bálint, Krammer, Olivér, Dusek, Karel, Busek, David

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Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy von Zhong, Xiankang, Lu, Wenjun, Liao, Bokai, Medgyes, Bálint, Hu, Junying, Zheng, Yan, Zeng, Dezhi, Zhang, Zhi

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Electrochemical Corrosion of SAC Alloys: A Review von Gharaibeh, Ali, Felhosi, Ilona, Keresztes, Zsofia, Harsanyi, Gabor, Illes, Balazs, Medgyes, Balint

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The effect of chloride ion concentration on electrochemical migration of copper von Medgyes, Bálint, Zhong, Xiankang, Harsányi, Gábor

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Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys von Illés, Balázs, Hurtony, Tamás, Medgyes, Bálint

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Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37 von Medgyes, Bálint, Illés, Balázs, Harsányi, Gábor

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Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics von Medgyes, Bálint, Horváth, Barbara, Illés, Balázs, Shinohara, Tadashi, Tahara, Akira, Harsányi, Gábor, Krammer, Olivér

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Erosion-corrosion and its mitigation on the internal surface of the expansion segment of N80 steel tube von Shang, Tan, Zhong, Xian-kang, Zhang, Chen-feng, Hu, Jun-ying, Medgyes, Bálint

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Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders von Krammer, Olivér, Garami, Tamás, Horváth, Barbara, Hurtony, Tamás, Medgyes, Bálint, Jakab, László

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Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films von Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David

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Vapour phase soldering (VPS) technology: a review von Illés, Balázs, Géczy, Attila, Medgyes, Bálint, Harsányi, Gábor

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Whisker growth from vacuum evaporated submicron Sn thin films von Illés, Balázs, Skwarek, Agata, Bátorfi, Réka, Ratajczak, Jacek, Czerwinski, Andrzej, Krammer, Olivér, Medgyes, Bálint, Horváth, Barbara, Hurtony, Tamás

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Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates von Medgyes, Bálint, Illés, Balázs, Harsányi, Gábor

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In situ optical inspection of electrochemical migration during THB tests von Medgyes, Bálint, Illés, Balázs, Berényi, Richárd, Harsányi, Gábor

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