Phase separation in the H2O-SiO2 system von McGahay, Vincent J.

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Conformal Mapping Solution for Interdigital Comb Capacitors Between Ground Planes von McGahay, Vincent

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Porous Dielectrics in Microelectronic Wiring Applications von McGahay, Vincent

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Inertial effects and diffusion von McGahay, Vincent

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Phase separation in rare-earth-doped SiO2 glasses von MCGAHAY, V, TOMOZAWA, M

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Manufacturing method for an artificially oriented piezoelectric film for integrated filters von Chandra, Bhupesh, McGahay, Vincent J

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Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects von Christiansen, C, Baozhen Li, Angyal, M, Kane, T, McGahay, V, Yun Yu Wang, Shaoning Yao

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Geometry, kinetics, and short length effects of electromigration in Mn doped Cu interconnects at the 32nm technology node von Christiansen, C., Baozhen Li, Angyal, M., Kane, T., McGahay, V., Yun Yu Wang, Shaoning Yao

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ARTIFICIALLY ORIENTED PIEZOELECTRIC FILM FOR INTEGRATED FILTERS von Chandra, Bhupesh, McGahay, Vincent J

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Artificially oriented piezoelectric film for integrated filters von Chandra, Bhupesh, McGahay, Vincent J

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ARTIFICIALLY ORIENTED PIEZOELECTRIC FILM FOR INTEGRATED FILTERS von Chandra, Bhupesh, McGahay, Vincent J

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Seal ring structure of integrated circuit and method of forming same von Polomoff, Nicholas A, McGahay, Vincent J

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Method to form air gap structure with dual dielectric layer von An, Ju Jin, Gruszecki, Craig R, Van Kleeck, Todd J, McGahay, Vincent J, Lee, Tim H

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Correspondence of phase separation in several charged particle systems von MCGAHAY, V, TOMOZAWA, M

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SEAL RING STRUCTURE OF INTEGRATED CIRCUIT AND METHOD OF FORMING SAME von Polomoff, Nicholas A, McGahay, Vincent J

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Crackstop structures von Polomoff, Nicholas A, McGahay, Vincent J

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METHOD TO FORM AIR GAP STRUCTURE WITH DUAL DIELECTRIC LAYER von An, Ju Jin, Gruszecki, Craig R, Van Kleeck, Todd J, McGahay, Vincent J, Lee, Tim H

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Dual dielectric layer for closing seam in air gap structure von An, Ju Jin, Gruszecki, Craig R, Van Kleeck, Todd J, McGahay, Vincent J, Lee, Tim H

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Arc-resistant crackstop von Polomoff, Nicholas A, McGahay, Vincent J, Yao, Shaoning, Arora, Anupam

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DUAL DIELECTRIC LAYER FOR CLOSING SEAM IN AIR GAP STRUCTURE von An, Ju Jin, Gruszecki, Craig R, Van Kleeck, Todd J, McGahay, Vincent J, Lee, Tim H

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