Characterization of solder interfaces using laser flash metrology von Chiu, Chia-Pin, Maveety, James G, Tran, Quan A

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Micromachined jets for liquid impingement cooling of VLSI chips von Wang, E.N., Lian Zhang, Linan Jiang, Jae-Mo Koo, Maveety, J.G., Sanchez, E.A., Goodson, K.E., Kenny, T.W.

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Closed-loop electroosmotic microchannel cooling system for VLSI circuits von Linan Jiang, Mikkelsen, J., Jae-Mo Koo, Huber, D., Shuhuai Yao, Lian Zhang, Peng Zhou, Maveety, J.G., Prasher, R., Santiago, J.G., Kenny, T.W., Goodson, K.E.

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Correction to "Micromachined Jets for Liquid Impingement Cooling of VLSI Chips" von Wang, E.N., Zhang, L., Jiang, L., Koo, J.-M., Maveety, J.G., Sanchez, E.A., Goodson, K.E., Kenny, T.W.

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Seal method for direct liquid cooling of probes used at first level interconnect von WALCZYK JOE, MAVEETY JAMES G, KIRBY RONALD

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Integrated circuit test temperature control mechanism von Maveety James G, Detofsky Abram M, Neeb James E, Johnson John C

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SEAL METHOD FOR DIRECT LIQUID COOLING OF PROBES USED AT FIRST LEVEL INTERCONNECT von WALCZYK JOE, MAVEETY JAMES G, KIRBY RONALD

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Die having a via filled with a heat-dissipating material von CHRYSLER GREGORY M, MAVEETY JAMES G

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Thermal interface material with carbon nanotubes and particles von Hua, Fay, Maveety, James G

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Thermal interface material with carbon nanotubes and particles von MAVEETY JAMES G, HUA FAY

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INTEGRATED CIRCUIT TEST TEMPERATURE CONTROL MECHANISM von Detofsky Abram M, MAVEETY James G, Neeb James E, Johnson John C

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Integrated circuit test temperature control mechanism von Maveety James G, Detofsky Abram M, Neeb James E, Johnson John C

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Apparatus to minimize thermal impedance using copper on die backside von Maveety James G, Ravi Kramadhati V, Hua Fay, Chrysler Gregory M

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MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING von CHRYSLER GREGORY M, MAVEETY JAMES G

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Nanotube based vapor chamber for die level cooling von CHRYSLER GREGORY MARTIN, MAVEETY JAMES G, VADAKKANMARUVEEDU UNNIKRISHNAN

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Micro-chimney and thermosiphon die-level cooling von Chrysler, Gregory M, Maveety, James G

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Micro-chimney and thermosiphon die-level cooling von CHRYSLER GREGORY M, MAVEETY JAMES G

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Thermisches Schnittstellenmaterial und Verfahren von MAVEETY, JAMES G, HUA, FAY

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THERMAL INTERFACE MATERIAL AND METHOD von MAVEETY JAMES G, HUA FAY

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Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same von Maveety James G, Shipley James C, Gupta Ashish, Acikalin Tolga, Rutigliano Michael L, Schroeder Christopher R, Sauciuc Ioan, Ackerman Christopher W

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