Controlled fracture of Cu/ultralow-k interconnects von Li, Han, Kobrinsky, Mauro J., Shariq, Ahmed, Richards, John, Liu, Jimmy, Kuhn, Markus

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The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films von Kobrinsky, Mauro J., Thompson, Carl V.

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Effect of support compliance and residual stress on the shape of doubly supported surface-micromachined beams von Kobrinsky, M.J., Deutsch, E.R., Senturia, S.D.

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Diffusional creep in damascene Cu lines von Kobrinsky, Mauro J., Thompson, Carl V., Gross, Mihal E.

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Activation volume for inelastic deformation in polycrystalline Ag thin films von Kobrinsky, Mauro J., Thompson, Carl V.

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Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution von Kuan-Neng Chen, Kobrinsky, M.J., Barnett, B.C., Reif, R.

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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren

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BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE von KOBRINSKY, Mauro J, MANNEBACH, Ehren, D'SILVA, Joseph

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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren

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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren

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DEVICE LAYER INTERCONNECTS von Bohr, Mark, Nabors, Marni, Kobrinsky, Mauro J

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Device layer interconnects von Bohr, Mark, Nabors, Marni, Kobrinsky, Mauro J

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GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES von GUHA, Biswajeet, KOBRINSKY, Mauro J, GHANI, Tahir

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Gate-all-around integrated circuit structures having asymmetric source and drain contact structures von Ghani, Tahir, Kobrinsky, Mauro J, Guha, Biswajeet

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SELECTIVE PASSIVATION FOR EPI GROWTH IN PRESENCE OF METALLIC CONTACTS von MILLS, Shaun, NASKAR, Sudipto, KOBRINSKY, Mauro J

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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren, D'SILVA, Joseph

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Hybrid manufacturing for integrating photonic and electronic components von Sharma, Abhishek A, Kobrinsky, Mauro J, Gomes, Wilfred

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BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT ON A TRANSISTOR LAYER von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren, D'SILVA, Joseph

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BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT ON A TRANSISTOR LAYER von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren, D'SILVA, Joseph

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INTEGRATED CIRCUIT STRUCTURE WITH BACK-SIDE CONTACT SELECTIVITY von MILLS, Shaun, KOBRINSKY, Mauro J, MANNEBACH, Ehren, D'SILVA, Joseph

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