Electromigration critical length effect in Cu/oxide dual-damascene interconnects von Lee, Ki-Don, Ogawa, Ennis T., Matsuhashi, Hideki, Justison, Patrick R., Ko, Kil-Soo, Ho, Paul S., Blaschke, Volker A.

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Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects von Ogawa, Ennis T., Bierwag, Alexander J., Lee, Ki-Don, Matsuhashi, Hideki, Justison, Patrick R., Ramamurthi, Anup N., Ho, Paul S., Blaschke, Volker A., Griffiths, David, Nelsen, Anne, Breen, Mark, Havemann, Robert H.

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Contribution of free electrons to Al CVD on a Si surface by photo-excitation von Masu, Kazuya, Yokoyama, Michio, Matsuhashi, Hideki, Tsubouchi, Kazuo

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Self-Aligned 10-nm Barrier Layer Formation Technology for Fully Self-Aligned Metallization Metal-Oxide-Semiconductor Field-Effect-Transistor von Matsuhashi, Hideki, Gotoh, Akio, Lee, Chang-Hun, Yokoyama, Michio, Masu, Kazuya, Tsubouchi, Kazuo

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Preparation of tetragonal perovskite single phase PbTiO3 film using an improved metal-organic chemical vapor deposition method alternately introducing Pb and Ti precursors von HIRAI, T, GOTO, T, MATSUHASHI, H, TANIMOTO, S, TARUI, Y

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STORAGE SYSTEM, STORAGE APPARATUS, DATA MIGRATION METHOD, AND PROGRAM von MATSUHASHI HIDEKI

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STORAGE DEVICE, AND METHOD AND PROGRAM FOR MANAGING STORAGE PERFORMANCE von MATSUHASHI HIDEKI

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Yield Improvement Using a Fast Product Wafer Level Monitoring System von Hess, C., Saadat, M., Inani, A., Yun Lin, Matsuhashi, H., Squicciarini, M., Lindley, R., Akiya, N., Kaste, E.F.

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Reliability and early failure in Cu/oxide dual-damascene interconnects von OGAWA, Ennis T, LEE, Ki-Don, MATSUHASHI, Hideki, HO, Paul S, BLASCHKE, Volker A, HAVEMANN, Robert H

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DISK ARRAY DEVICE von MATSUHASHI HIDEKI

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IC with test structures and e-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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IC with test structures and e-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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IC with test structures and e-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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IC with test structures and E-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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IC with test structures and e-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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Superiority of DMAH to DMEAA for al CVD technology von Matsuhashi, Hideki, Lee, Chang-Hun, Nishimura, Takamasa, Masu, Kazuya, Tsubouchi, Kazuo

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IC with test structures and E-beam pads embedded within a contiguous standard cell area von Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che

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Crystallographic Structures and Parasitic Resistances of Self-Aligned Silicide TiSi 2 /Self-Aligned Nitrided Barrier Layer/Selective Chemical Vapor Deposited Aluminum in Fully Self... von Lee, Chang-Hun, Nishimura, Takamasa, Matsuhashi, Hideki, Yokoyama, Michio, Masu, Kazuya, Tsubouchi, Kazuo

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MAXIMUM SPEED LIMITING DEVICE OF BICYCLE von MATSUHASHI HIDEKI

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DISK ARRAY DEVICE von MATSUHASHI HIDEKI

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