Directionally Solidified Al–Cu–Si–Fe Quaternary Eutectic Alloys von Büyük, U., Engin, S., Kaya, H., Çadırlı, E., Maraşlı, N.

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The microstructure parameters and microhardness of directionally solidified Sn–Ag–Cu eutectic alloy von BÖYÜK, U, MARASLI, N

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Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn–Ag–Cu lead-free solder von Böyük, U., Maraşlı, N.

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Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al–Cu alloys von Aksöz, S., Ocak, Y., Maraşlı, N., Çadirli, E., Kaya, H., Böyük, U.

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Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys von Kaya, H., Çadırlı, E., Böyük, U., Maraşlı, N.

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Microstructural characterization of unidirectional solidified eutectic Al–Si–Ni alloy von Böyük, U., Engin, S., Maraşlı, N.

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Determination of interfacial energies in the Al–Ag and Sn–Ag alloys by using Bridgman type solidification apparatus von Engin, S., Böyük, U., Maraşlı, N.

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Dependency of thermal conductivity on the temperature and composition of d-camphor in the neopentylglycol–d-camphor alloys von Bayram, Ue, Aksoz, S, Marasli, N

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Directional solidification of Al–Cu–Ag alloy von Böyük, U., Maraşlı, N., Kaya, H., Çadırlı, E., Keşlioğlu, K.

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Determination of solid–liquid interfacial energy for a solid Sn in equilibrium with a Sn–Ag–Zn eutectic liquid von Engin, S., Böyük, U., Maraşlı, N.

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Solid–liquid interfacial energy of the eutectoid β phase in the Al–Zn eutectic system von KESLIOGLU, K, MARASLI, N

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Solid–liquid interfacial energy of the solid Mg2Zn11 phase in equilibrium with Zn–Mg eutectic liquid von Erol, M, Keşlioğlu, K, Maraşli, N

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The measurement of thermal conductivity variation with temperature for solid materials von Aksoez, S, Oeztuerk, E, Marasli, N

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Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn–1.2 wt.% Cu alloy von Çadırlı, E., Böyük, U., Engin, S., Kaya, H., Maraşlı, N., Ülgen, A.

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Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy von Kaya, H., Böyük, U., Çadırlı, E., Maraşlı, N.

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Dependency of microindentation hardness on solidification processing parameters and cellular spacing in the directionally solidified Al based alloys von Kaya, H., Gündüz, M., Çadırlı, E., Maraşlı, N.

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The effect of growth rate on microstructure and microindentation hardness in the In–Bi–Sn ternary alloy at low melting point von Çadırlı, E., Böyük, U., Kaya, H., Maraşlı, N., Keşlioğlu, K., Akbulut, S., Ocak, Y.

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Directional solidification of Zn-Al-Cu eutectic alloy by the vertical Bridgman method von Büyük, U., Engin, S., Maraşlı, N.

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Novel experimental technique to observe equilibrated grain boundary groove shapes in opaque alloys von Böyük, U., Engin, S., Maraşlı, N.

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Variations of thermal conductivity with temperature and composition of Zn in the Bi―[x] at.% Zn―2 at.% Al alloys von AKSÖZ, S, MARASLI, N, KESLIOGLU, K, YILDIZ, F

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