Directionally Solidified Al–Cu–Si–Fe Quaternary Eutectic Alloys von Büyük, U., Engin, S., Kaya, H., Çadırlı, E., Maraşlı, N.

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Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn–Ag–Cu lead-free solder von Böyük, U., Maraşlı, N.

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Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al–Cu alloys von Aksöz, S., Ocak, Y., Maraşlı, N., Çadirli, E., Kaya, H., Böyük, U.

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Determination of solid–liquid interfacial energy for a solid Sn in equilibrium with a Sn–Ag–Zn eutectic liquid von Engin, S., Böyük, U., Maraşlı, N.

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Dependency of thermal conductivity on the temperature and composition of d-camphor in the neopentylglycol–d-camphor alloys von Bayram, Ue, Aksoz, S, Marasli, N

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Directional solidification of Al–Cu–Ag alloy von Böyük, U., Maraşlı, N., Kaya, H., Çadırlı, E., Keşlioğlu, K.

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Solid–liquid interfacial energy of the eutectoid β phase in the Al–Zn eutectic system von KESLIOGLU, K, MARASLI, N

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Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn–1.2 wt.% Cu alloy von Çadırlı, E., Böyük, U., Engin, S., Kaya, H., Maraşlı, N., Ülgen, A.

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The influence of the growth rate on the eutectic spacings, undercoolings and microhardness of directional solidified bismuth–lead eutectic alloy von Koçak, Y., Engin, S., Böyük, U., Maraşlı, N.

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Variations of thermal conductivity with temperature and composition of Zn in the Bi–[x]at.% Zn–2at.% Al alloys von Aksöz, S., Maraşlı, N., Keşlioğlu, K., Yıldız, F.

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Thermal conductivity and interfacial energies of solid Sn₃Sb₂ in the Sn–Sb peritectic system von Kaygısız, Y, Ocak, Y, Aksöz, S, Keşlioğlu, K, Maraşlı, N

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The effect of growth rate on microstructure and microindentation hardness in the In–Bi–Sn ternary alloy at low melting point von Çadırlı, E., Böyük, U., Kaya, H., Maraşlı, N., Keşlioğlu, K., Akbulut, S., Ocak, Y.

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Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al–Cu–Ag eutectic alloy von Böyük, U., Maraşlı, N., Çadırlı, E., Kaya, H., Keşlioğlu, K.

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Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy von Ocak, Y., Aksöz, S., Maraşlı, N., Keşlioğlu, K.

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Solid–liquid interfacial energy of solid aminomethylpropanediol solution in equilibrium with aminomethylpropanediol–neopentylglycol–D camphor liquid von Bayram, Ü., Aksöz, S., Maraşlı, N.

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Solid–liquid interfacial energy of neopentylglycol von Ocak, Y., Akbulut, S., Keşlioğlu, K., Maraşlı, N.

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Directional solidification and physical properties measurements of the zinc-aluminum eutectic alloy von Engin, S., Böyük, U., Kaya, H., Maraşlı, N.

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Effect of solidification processing parameters on the cellular spacings in the Al–0.1 wt% Ti and Al–0.5 wt% Ti alloys von Gündüz, M., Kaya, H., Çadırlı, E., Maraşlı, N., Keşlioğlu, K., Saatçi, B.

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Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy von Çadırlı, E., Böyük, U., Engin, S., Kaya, H., Maraşlı, N., Arı, M.

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Investigation of the effect of solidification processing parameters on microhardness and determination of thermo–physical properties in the Zn–Cu peritectic alloy von Böyük, U., Kaya, H., Çadırlı, E., Maraşlı, N., Ülgen, A.

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