A new linear method to calculate monomer reactivity ratios by using high conversion copolymerization data: terminal model von Mao, Runsheng, Huglin, Malcolm B.

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A new linear method to calculate monomer reactivity ratios by using high-conversion copolymerization data: penultimate model with r2=0 von Mao, Runsheng, Huglin, Malcolm B.

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TEXTURE PROPERTIES OF GELLAN GELS AS AFFECTED BY TEMPERATURE von MAO, RUNSHENG, TANG, JUMING, SWANSON, BARRY G.

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Determination of monomer reactivity ratios in the cross-linking copolymerization of methyl methacrylate with ethylene dimethacrylate von RUNSHENG MAO, YAN LIU, HUGLIN, M. B, HOLMES, P. A

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Effect of pH buffers on mechanical properties of gellan gels von Mao, R, Tang, J, Swanson, B.G

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Dynamic light scattering from polymer gels: spring-rotor model von Mao, Runsheng, Liu, Yan, Huglin, Malcolm B., Holmes, Paul A.

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FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY von Mao, Runsheng, Chen, Fen, Lee, Ning-Cheng

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RANCIDITY OF WALNUTS AND ALMONDS AFFECTED BY SHORT TIME HEAT TREATMENTS FOR INSECT CONTROL von BURANSOMPOB, ATHISAYA, TANG, JUMING, MAO, RUNSHENG, SWANSON, BARRY G.

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RANCIDITY OF WALNUTS AND ALMONDS AFFECTED BY SHORT TIME HEAT TREATMENTS FOR INSECT CONTROL von BURANSOMPOB, ATHISAYA, TANG, JUMING, MAO, RUNSHENG, SWANSON, BARRY G.

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Some aspects of the copolymerization of glyceryl methacrylate with methyl methacrylate von Liu, Yan, Mao, Runsheng, Huglin, Malcolm B., Holmes, Paul A.

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Quantitative analysis of copolymers by FTIR von Mao, Runsheng, Huglin, Malcolm B., Davis, Thomas P.

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LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING von Lee, Ning-Cheng, Mao, Runsheng

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iNEMI Solder Paste Deposition Project report - Optimizing solder paste printing for large and small components von Chen, C, Laye Feng, Mohanty, R, Runsheng Mao, Chuan Xia, Teoh, D

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Versatile TIM Solution with Chain Network Solder Composite von Mao, Runsheng, Chen, Sihai, Zito, Elaina, Bedner, David, Lee, Ning-Cheng

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Reactivity ratios for new copolymerizations relevant to thermosetting resins von Mao, Runsheng, Huglin, Malcolm B., Davis, Thomas P., Overend, Andrew S.

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iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components von Shoukai Zhang, Mohanty, R., Xiaodong Jiang, Runsheng Mao, Lee, J.C.-B., Chuan Xia, Sweatman, K., Teoh, D.

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Materials having increased mobility after heating von Lee, Ning-Cheng, Mao, Runsheng

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Lead-free solder paste as thermal interface material von Bedner, David, Lee, Ning-Cheng, Mao, Runsheng, Chen, Sihai, Zito, Elaina

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LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL von Bedner, David, Lee, Ning-Cheng, Mao, Runsheng, Chen, Sihai, Zito, Elaina

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EFECT OF pH BUFFERS ON MECHANICAL PROPERTIES OF GELLAN GELS von MAO, RUNSHENG, TANG, JUMING, SWANSON, BARRY G.

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