Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package von Pekkanen, Ville, Mäntysalo, Matti, Kaija, Kimmo, Mansikkamäki, Pauliina, Kunnari, Esa, Laine, Katja, Niittynen, Juha, Koskinen, Santtu, Halonen, Eerik, Caglar, Umur

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Environmental evaluation of new technology: printed electronics case study von Kunnari, Esa, Valkama, Jani, Keskinen, Marika, Mansikkamäki, Pauliina

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Inkjetting dielectric layer for electronic applications von Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Koskinen, Santtu, Niittynen, Juha, Halonen, Eerik, Mansikkamäki, Pauliina

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An inkjet-deposited antenna for 2.4 GHz applications von Mäntysalo, Matti, Mansikkamäki, Pauliina

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Functional fluid jetting performance optimization von Pekkanen, Ville, Kaija, Kimmo, Mäntysalo, Matti, Kunnari, Esa, Niittynen, Juha, Mansikkamäki, Pauliina

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Controlling warpage of molded package for inkjet manufacturing von Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Mansikkamäki, Pauliina

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Formable multilayer PCB structure: design and technology demonstrator von Peltola, Tero, Mansikkamäki, Pauliina

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Inkjet printed System-in-Package design and manufacturing von Miettinen, Jani, Pekkanen, Ville, Kaija, Kimmo, Mansikkamäki, Pauliina, Mäntysalo, Juha, Mäntysalo, Matti, Niittynen, Juha, Pekkanen, Jussi, Saviauk, Taavi, Rönkkä, Risto

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Analysis of mechanical performance of silver inkjet-printed structures von Caglar, U., Kimmo Kaija, Mansikkamaki, P.

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Evaluation of Inkjet Technology for Electronic Packaging and System Integration von Mantysalo, Matti, Mansikkamaki, Pauliina, Miettinen, Jani, Kaija, Kimmo, Pienimaa, Seppo, Ronkka, Risto, Hashizume, Kenichi, Kamigori, Akiko, Matsuba, Yorishige, Oyama, Kenshu, Terada, Nobuto, Saito, Hiroshi, Kuchiki, Mikiharu, Tsubouchi, Mikihiko

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Capability of inkjet technology in electronics manufacturing von Mantysalo, M., Pekkanen, V., Kaija, K., Niittynen, J., Koskinen, S., Halonen, E., Mansikkamaki, P., Hameenoja, O.

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Integrative Technologies Complicate Communication during Development Work Context: Industry-Academy Collaboration von Pauliina Mansikkamäki, Matti Mäntysalo, Risto Rönkkä

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Industry-Academy Research Framework on Electronics Hardware Innovations von Pauliina Mansikkamäki, Matti Mäntysalo, Markku Kivikoski, Seppo Pienimaa, Reijo Paajanen

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Application of wide-band material parameter extraction techniques to printable electronics characterization von Sillanpaa, H., Lilja, J., Makinen, R., Ostman, K., Palukuru, V., Virtanen, J., Pynttari, V., Kanerva, T., Hagberg, J., Lepisto, T., Jantunen, H., Mansikkamaki, P.

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Molded Substrates for Inkjet Printed Modules von Miettinen, J., Kaija, K., Mantysalo, M., Mansikkamaki, P., Kuchiki, M., Tsubouchi, M., Ronkka, R., Hashizume, K., Kamigori, A.

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Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines von Lilja, J., Makinen, R., Pynttari, V., Mansikkamaki, P., Kivikoski, M.

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Significance of Conductivity and Thickness of Thin Inkjet Printed Microstrip Lines von Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mansikkamaki, P., Kivikoski, M.

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High-frequency characterization and simulation of conductor loss in printable electronics technology von Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mantysalo, M., Mansikkamaki, P., Kivikoski, M.

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3D integration of electronics and mechanics von Peltola, T., Mansikkamaki, P., Ristolainen, E.O.

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Effects of 3D shapes in PWB design von Peltola, T., Mansikkamaki, P., Ristolainen, E.O.

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