Empreintes rouges: Nouvelles perspectives pour l’histoire du communisme français von Roubaud-Quashie, Guillaume, Manessis, Dimitri

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Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages von Wong, C.S., Bennett, N.S., Manessis, D., Danilewsky, A., McNally, P.J.

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Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders von HUANG, M. L, LOEHER, T, MANESSIS, D, BOETTCHER, L, OSTMANN, A, REICHL, H

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Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control von Pitilakis, A., Seckel, M., Tasolamprou, A.C., Liu, F., Deltsidis, A., Manessis, D., Ostmann, A., Kantartzis, N.V., Liaskos, C., Soukoulis, C.M., Tretyakov, S.A., Kafesaki, M., Tsilipakos, O.

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Oxidation studies of silicon oxynitride ceramics von MANESSIS, D, HONGHUA DU, LARKER, R

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Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping von Manessis, Dionysios, Patzelt, Rainer, Ostmann, Andreas, Aschenbrenner, Rolf, Reichl, Herbert

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Oxide and interface characteristics of oxidized silicon oxynitride ceramics : an investigation by electron microscopy von MANESSIS, D, DU, H, LARKER, R

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Next Generation System in a Package Manufacturing by Embedded Chip Technologies von Boettcher, Lars, Manessis, D., Karaszkiewicz, S., Ostmann, A., Reichl, H.

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Industrial and technical aspects of chip embedding technology von Ostmann, A., Manessis, D., Stahr, J., Beesley, M., Cauwe, M., De Baets, J.

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Next Generation System in a Package Manufacturing by Embedded Chip Technologies: Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging,... von BOETTCHER, Lars, MANESSIS, D, KARASZKIEWICZ, S, OSTMANN, A, REICHL, H

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Perspectives pour l'histoire du communisme français von Calenda

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Implementation of chip embedding processes for the creation of miniaturized system-in-packages von Boettcher, L, Manessis, D, Ostmann, A, Karaszkiewicz, S, Aschenbrenner, R, Lang, K.-D

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Thermo-mechanical analysis of advanced electronic packages in early system design von SOMMER, Johann-Peter, WITTIER, Olaf, MANESSIS, Dionysios, MICHEL, Bernd

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XR-RF Imaging Enabled by Software-Defined Metasurfaces and Machine Learning: Foundational Vision, Technologies and Challenges von Liaskos, C, Tsioliaridou, A, Georgopoulos, K, Morianos, G, Ioannidis, S, Salem, I, Manessis, D, S Schmid D Tyrovolas, Tegos, S A, P -V Mekikis, Diamantoulakis, P D, Pitilakis, A, Kantartzis, N, G K Karagiannidis A Tasolamprou, Tsilipakos, O, Kafesaki, M, Akyildiz, I F, Pitsillides, A, Pateraki, M, Vakalellis, M, Spais, I

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Multi-functional metasurface architecture for amplitude, polarization and wavefront control von Pitilakis, A, Seckel, M, Tasolamprou, A C, Liu, F, Deltsidis, A, Manessis, D, Ostmann, A, Kantartzis, N V, Liaskos, C, Soukoulis, C M, Tretyakov, S A, Kafesaki, M, Tsilipakos, O

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Oxide and interface characteristics of oxidized silicon oxynitride ceramic--an investigation by electron microscopy von Du, H, Manessis, D, Larker, R

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Millimeter-Wave Propagation within a Computer Chip Package von Timoneda, X, Abadal, S, Cabellos-Aparicio, A, Manessis, D, Zhou, J, Franques, A, Torrellas, J, Alarcón, E

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Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology von Kossifos, K.M, Petrou, L, Varnava, G, Pitilakis, A, Tsilipakos, O, Liu, F, Karousios, P, Tasolamprou, A.C, Seckel, M, Manessis, D, Kantartzis, N.V, Kwon, D.-H, Antoniades, M.A, Georgiou, J

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Design process supporting simulations on wafer level packages von Sommer, J.-P., Wittler, O., Manessis, D., Michel, B.

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Embedding of Chips for System in Package realization - Technology and Applications von Boettcher, L., Manessis, D., Ostmann, A., Karaszkiewicz, S., Reichl, H.

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