Strain Relaxation of Monolayer WS2 on Plastic Substrate von Zhang, Qianhui, Chang, Zhenyue, Xu, Guanzhong, Wang, Ziyu, Zhang, Yupeng, Xu, Zai-Quan, Chen, Shujian, Bao, Qiaoliang, Liu, Jefferson Zhe, Mai, Yui-Wing, Duan, Wenhui, Fuhrer, Michael S., Zheng, Changxi

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Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages von Wong, E.H., Rajoo, R., Lim, T.B., Yui-Wing Mai

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Strain Relaxation of Monolayer WS sub(2) on Plastic Substrate von Zhang, Qianhui, Chang, Zhenyue, Xu, Guanzhong, Wang, Ziyu, Zhang, Yupeng, Xu, Zai-Quan, Chen, Shujian, Bao, Qiaoliang, Liu, Jefferson Zhe, Mai, Yui-Wing, Duan, Wenhui, Fuhrer, Michael S, Zheng, Changxi

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Strain Relaxation of Monolayer WS 2 on Plastic Substrate von Zhang, Qianhui, Chang, Zhenyue, Xu, Guanzhong, Wang, Ziyu, Zhang, Yupeng, Xu, Zai‐Quan, Chen, Shujian, Bao, Qiaoliang, Liu, Jefferson Zhe, Mai, Yui‐Wing, Duan, Wenhui, Fuhrer, Michael S., Zheng, Changxi

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