Cu passivation for integration of gap-filling ultralow-k dielectrics von Zhang, Liping, de Marneffe, Jean-Francois, Lesniewska, Alicja, Verdonck, Patrick, Heylen, Nancy, Murdoch, Gayle, Croes, Kristof, Boemmels, Juergen, Tokei, Zsolt, De Gendt, Stefan, Baklanov, Mikhail R.

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Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below von Decoster, Stefan, Camerotto, Elisabeth, Murdoch, Gayle, Kundu, Souvik, Le, Quoc Toan, Tőkei, Zsolt, Jurczak, Gosia, Lazzarino, Frédéric

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Controlled cobalt recess for advanced interconnect metallization von Pacco, Antoine, Akanishi, Yuya, Le, Quoc Toan, Kesters, Els, Murdoch, Gayle, Holsteyns, Frank

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Wet Cleaning of Molybdenum for Nano Interconnects von Le, Quoc-Toan, Guevenc, Haci, Ibrahim, Ansar, Klipp, Andreas, Decoster, Stefan, Murdoch, Gayle, Sanchez, Efrain Altamirano

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Cu passivation for integration of gap-filling ultralow-k dielectrics von Zhang, Liping, de Marneffe, Jean-Francois, Lesniewska, Alicja, Verdonck, Patrick, Heylen, Nancy, Murdoch, Gayle, Croes, Kristof, Boemmels, Juergen, Tokei, Zsolt, De Gendt, Stefan, Baklanov, Mikhail

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Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects von Ključar, Luka, González, Mario, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Murdoch, Gayle, Nolmans, Philip, De Vos, Joeri, Bömmels, Jürgen, Beyne, Eric, Tőkei, Zsolt

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Evaluation of Post Etch Residue Cleaning Solutions for the Removal of TiN Hardmask after Dry Etch of Low-k Dielectric Materials on 45 nm Pitch Interconnects von Lippy, Steven, Le, Quoc Toan, Murdoch, Gayle, Gonzalez, Victor V., Payne, Makonnen, Kesters, Els, Lieten, Ruben R., Holsteyns, Frank

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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications von Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, Eric

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Wet Cleaning of Molybdenum for Nano Interconnects von Le, Quoc-Toan, Guevenc, Haci, Ibrahim, Ansar, Klipp, Andreas, Decoster, Stefan, Murdoch, Gayle, Sanchez, Efrain Altamirano

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A METHOD FOR FORMING AN INTERCONNECT STRUCTURE von RYCKAERT, Julien, O´TOOLE, Martin, WECKX, Pieter, TOKEI, Zsolt, MURDOCH, Gayle

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Alternative integration of ultra low-k dielectrics by template replacement approach von Zhang, Liping, de Marneffe, Jean-Francois, Heylen, Nancy, Murdoch, Gayle, Tokei, Zsolt, Boemmels, Juergen, De Gendt, Stefan, Baklanov, Mikhaïl

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Optical Waveguide Structure and Method of Manufacture Thereof von CLEMENTS STEPHEN JOHN, O'KEEFE MATTHEW FRANCIS, MURDOCH GAYLE

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AN INTEGRATED OPTICAL MODULATOR von MILLER, ROBERT, ANDREW, MURDOCH, GAYLE

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AN INTEGRATED OPTICAL MODULATOR von MILLER, ROBERT, ANDREW, MURDOCH, GAYLE

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Optical modulator von ROBERT ANDREW MILLER, GAYLE MURDOCH

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OPTICAL WAVEGUIDE STRUCTURE AND METHOD OF MANUFACTURE THEREOF von CLEMENTS STEPHEN JOHN, O'KEEFE MATTHEW FRANCIS, MURDOCH GAYLE

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An optical waveguide structure and method of manufacture thereof von MATTHEW FRANCIS O'KEEFE, GAYLE MURDOCH, STEVEN JOHN CLEMENTS

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AN OPTICAL WAVEGUIDE STRUCTURE COMPRISING AN ETCH-STOP LAYER AND A METHOD OF MANUFACTURE THEREOF von CLEMENTS, STEPHEN, JOHN, O'KEEFE, MATTHEW, FRANCIS, MURDOCH, GAYLE

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AN OPTICAL WAVEGUIDE STRUCTURE AND METHOD OF MANUFACTURE THEREOF von CLEMENTS, STEPHEN, JOHN, O'KEEFE, MATTHEW, FRANCIS, MURDOCH, GAYLE

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Optical waveguide comprising aluminium-phosphorus etch stop layer von MATTHEW FRANCIS O'KEEFE, GAYLE MURDOCH, STEVEN JOHN CLEMENTS

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