Evolution of rivulets during spreading of an impinging water jet on a rotating, precoated substrate von Ylitalo, Andrew S., Walls, Daniel J., Mui, David S. L., Frostad, John M., Fuller, Gerald G.

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Wafer Surface Charging Model for Single-Wafer Wet-Spin Processes von Mui, D. S. L., Lenz, E. H., Cyterski, C., Venkataraman, K., Kawaguchi, M.

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SiO2 Etching with Aqueous HF: Design and Development of a Laboratory-Scale Integrated Wet Etch/Dry Reactor von PANDE, Ashish A, MUI, David S. L, HESS, Dennis W

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Selective molecular gas phase etching in layered high aspect-ratio nanostructures for semiconductor processing. I. Modeling framework and simulation von Zajo, Zach, Mui, David S. L., Zhu, Ji, Kawaguchi, Mark, Shaqfeh, Eric S. G.

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Selective molecular gas phase etching in layered high aspect-ratio nanostructures for semiconductor processing. II. Experiments and model validation von Zajo, Zach, Mui, David S. L., Zhu, Ji, Shari’ati, Yusef, Kawaguchi, Mark, Shaqfeh, Eric S. G.

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Etching With Aqueous HF: Design and Development of a Laboratory-Scale Integrated Wet Etch/Dry Reactor von Pande, A A, Mui, D S L, Hess, D W

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Factors Influencing Drying Induced Pattern Collapse von Mui, David S.L., Kawaguchi, Mark, Musselwhite, Nathan

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Spreading of rinsing liquids across a horizontal rotating substrate von Walls, Daniel J., Ylitalo, Andrew S., Mui, David S. L., Frostad, John M., Fuller, Gerald G.

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Enhanced particle removal using viscoelastic fluids von Walker, Travis W., Hsu, Tienyi T., Fitzgibbon, Sean, Frank, Curtis W., Mui, David S. L., Zhu, Ji, Mendiratta, Arjun, Fuller, Gerald G.

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Chamber stability monitoring by an integrated metrology tool von S. L. MUI, DAVID S. L, LIU, WEI, SASANO, HIROKI

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Design of a Novel Wet-Etch Reactor and Etch Chemistries: Simulations and Experimental Verification von Pande, Ashish, Levitin, Galit, Mui, David S., Hess, Dennis

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Line-profile and critical-dimension monitoring using a normal incidence optical CD metrology von Weidong Yang, Jiangtao Hu, Lowe-Webb, R., Korlahalli, R., Shivaprasad, D., Sasano, H., Wei Liu, Mui, D.S.L.

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rm SiO 2 Etching With Aqueous HF: Design and Development of a Laboratory-Scale Integrated Wet Etch/Dry Reactor von Pande, Ashish A, Mui, David SL, Hess, Dennis W

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DUAL SENSOR WAFER TEMPERATURE MEASUREMENT SYSTEM von KAWAGUCHI, Mark Naoshi, MUI, David S. L, HUANG, Zhilin, BERNEY, Butch, KALINOVSKI, Ilia

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Reference wafer for high fidelity in-situ temperature metrology calibration von MUI, DAVID S. L, GAO, SONGQI

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LIQUID-COOLED OPTICAL WINDOW FOR SEMICONDUCTOR PROCESSING CHAMBER von KAWAGUCHI, Mark Naoshi, MUI, David S. L, GAO, Songqi, CHOKSHI, Himanshu, BERNEY, Butch, KALINOVSKI, Ilia, CORD, Bryan

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RADIATIVE HEAT WINDOWS AND WAFER SUPPORT PADS IN VAPOR ETCH REACTORS von KAWAGUCHI, Mark Naoshi, MUI, David S. L, PARIMI, Venkata Sharat Chandra, CORD, Bryan Michael, BERNEY, Butch, AMBUROSE, Gnanamani, KALINOVSKI, Ilia

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SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS von KAWAGUCHI, Mark Naoshi, MUI, David S. L, LAVOIE, Adrien, ZHU, Ji, MELAET, Gerome Michel Dominique, MUSSELWHITE, Nathan

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Explicit formulas of normalized radiation modes in multilayer waveguides von San-Liang Lee, Mui, S.D.L., Coldren, L.A.

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Effects of surface recombination on carrier distributions and device characteristics von Mui, David S. L., Coldren, L. A.

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