Strain mapping and simulation of transistor structures in a 22nm FDSOI technology von Utess, Dirk, Kleimaier, Dominik Martin, Billan, Etienne, Youssuf, Tashfain, Zhao, Zhixing, Nemec, Thorgund, Meyer, Moritz Andreas, Rinderknecht, Jochen

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Observation of logic states of HfO2-based ferroelectric FETs using STEM-DPC von Nemec, Thorgund, Utess, Dirk, Duenkel, Stefan, Weisheit, Martin, Mulaosmanovic, Halid, Beyer, Sven, Meyer, Moritz Andreas

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In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures von Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M., Meyer, Moritz Andreas, Zschech, Ehrenfried

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Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation von Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy

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New Microstructure-Related EM Degradation and Failure Mechanisms in Cu Interconnects with CoWP Coating von Meyer, Moritz Andreas, Zschech, Ehrenfried

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In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures von Meyer, M.A, Herrmann, M, Langer, E, Zschech, E

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Method comprising applying an external mechanical stress to a semiconductor structure and semiconductor processing tool von WÜRFEL ALEXANDER, MEYER MORITZ ANDREAS

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Challenges of electromigration von Zschech, Ehrenfried, Meyer, Moritz Andreas, Grafe, Marco, Schneider, Gerd

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Challenges of electromigration: Electromigration degradation mechanisms in copper dual-inlaid interconnects von Zschech, Ehrenfried, Meyer, Moritz Andreas, Grafe, Marco, Schneider, Gerd

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Metal line layout based on line shifting von Lehr Matthias U, Hassmann Jens, Herrmann Thomas, Kuncha Rakesh Kumar, Meyer Moritz Andreas, Melde Thomas

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Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance von LEHR MATTHIAS, LANGER ECKHARD, MEYER MORITZ ANDREAS

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METAL LINE LAYOUT BASED ON LINE SHIFTING von Lehr Matthias U, Hassmann Jens, Herrmann Thomas, Kuncha Rakesh Kumar, Meyer Moritz Andreas, Melde Thomas

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Method of forming an alloy in an interconnect structure to increase electromigration resistance von Lehr, Matthias, Meyer, Moritz-Andreas, Langer, Eckhard

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Method of forming an alloy in an interconnect structure to increase electromigration resistance von LEHR MATTHIAS, LANGER ECKHARD, MEYER MORITZ-ANDREAS

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TECHNIQUE FOR FORMING METAL LINES IN A SEMICONDUCTOR BY ADAPTING THE TEMPERATURE DEPENDENCE OF THE LINE RESISTANCE von LEHR MATTHIAS, LANGER ECKHARD, MEYER MORITZ ANDREAS

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Potential and Limits of Texture Measurement Techniques for Inlaid Copper Process Optimization von Geisler, Holm, Ziernet, Inka, Prinz, Hartmut, Meyer, Moritz-Andreas, Zschech, Ehrenfried

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Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance von LEHR MATTHIAS, LANGER ECKHARD, MEYER MORITZ ANDREAS

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Method of testing an integrity of a material layer in a semiconductor structure von Meyer, Moritz Andreas, Langer, Eckhard, Koschinsky, Frank

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Method of testing an integrity of a material layer in a semiconductor structure von KOSCHINSKY FRANK, LANGER ECKHARD, MEYER MORITZ ANDREAS

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Technique for forming metal lines in a semiconductor by adapting the temperature dependence of the line resistance von Meyer, Moritz Andreas, Lehr, Matthias, Langer, Eckhard

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