Treffer 1 - 15 von 15 für Suche 'MEZZAPELLE JOSEPH J', Suchdauer: 0,57s Treffer weiter einschränken
  1. 1
    Etching processes using C4F8 for silicon dioxide and CF4 for titanium nitride

    Etching processes using C4F8 for silicon dioxide and CF4 for titanium nitride von MEZZAPELLE JOSEPH J

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  2. 2
    Etching processes using C

    Etching processes using C von Mezzapelle, Joseph J

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  3. 3
    Etching method letting the conductor outside

    Etching method letting the conductor outside von MEZZAPELLE JOSEPH J

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  4. 4
    ETCHING PROCESSES USING C4F8 FOR SILICON DIOXIDE

    ETCHING PROCESSES USING C4F8 FOR SILICON DIOXIDE von MEZZAPELLE JOSEPH J

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  5. 5
    Determining root cause for alarm in processing system

    Determining root cause for alarm in processing system von MEZZAPELLE JOSEPH J, GOODRICH STEPHEN W, ZHOU LIN, SHNEYDER DMITRIY

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  6. 6
    Determining root cause for alarm in processing system

    Determining root cause for alarm in processing system von Shneyder, Dmitriy, Goodrich, Stephen W, Mezzapelle, Joseph J, Zhou, Lin

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  7. 7
    DETERMINING ROOT CAUSE FOR ALARM IN PROCESSING SYSTEM

    DETERMINING ROOT CAUSE FOR ALARM IN PROCESSING SYSTEM von MEZZAPELLE JOSEPH J, GOODRICH STEPHEN W, ZHOU LIN, SHNEYDER DMITRIY

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  8. 8
    Apparatus and method to improve resist line roughness in semiconductor wafer processing

    Apparatus and method to improve resist line roughness in semiconductor wafer processing von LI WAI-KIN, MEZZAPELLE JOSEPH J, MALIK RAJEEV

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  9. 9
    Apparatus and method to improve resist line roughness in semiconductor wafer processing

    Apparatus and method to improve resist line roughness in semiconductor wafer processing von Li, Wai-kin, Malik, Rajeev, Mezzapelle, Joseph J

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  10. 10
    Apparatus and method to improve resist line roughness in semiconductor wafer processing

    Apparatus and method to improve resist line roughness in semiconductor wafer processing von LI WAI-KIN, MEZZAPELLE JOSEPH J, MALIK RAJEEV

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  11. 11
    Apparatus and method to improve resist line roughness in semiconductor wafer processing

    Apparatus and method to improve resist line roughness in semiconductor wafer processing von LI WAI-KIN, MEZZAPELLE JOSEPH J, MALIK RAJEEV

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  12. 12
    MIMcap top plate pull-back

    MIMcap top plate pull-back von YANG HAINING, MEZZAPELLE JOSEPH J, KERST UWE, FAYAZ MOHAMMED FAZIL

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  13. 13
    MIMcap top plate pull-back

    MIMcap top plate pull-back von Fayaz, Mohammed Fazil, Yang, Haining, Kerst, Uwe, Mezzapelle, Joseph J

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  14. 14
    Determining root cause for alarm in processing system

    Determining root cause for alarm in processing system von MEZZAPELLE JOSEPH J, GOODRICH STEPHEN W, ZHOU LIN, SHNEYDER DMITRIY

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  15. 15
    Extreme scaling with ultra-thin Si channel MOSFETs

    Extreme scaling with ultra-thin Si channel MOSFETs von Doris, B., Meikei Ieong, Kanarsky, T., Ying Zhang, Roy, R.A., Dokumaci, O., Zhibin Ren, Fen-Fen Jamin, Leathen Shi, Natzle, W., Hsiang-Jen Huang, Mezzapelle, J., Mocuta, A., Womack, S., Gribelyuk, M., Jones, E.C., Miller, R.J., Wong, H.-S.P., Haensch, W.

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