Fluorescence and Redox Activity of Probes Anchored through an Aminotrithiol to Polycrystalline Gold von Fox, Marye Anne, Whitesell, James K, McKerrow, Andrew J

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Constraint Effects on Thin Film Channel Cracking Behavior von Tsui, Ting Y., McKerrow, Andrew J., Vlassak, Joost J.

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The effect of water diffusion on the adhesion of organosilicate glass film stacks von Tsui, Ting Y., McKerrow, Andrew J., Vlassak, Joost J.

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Materials Issues and Characterization of Low-k Dielectric Materials von Ryan, E. Todd, McKerrow, Andrew J., Leu, Jihperng, Ho, Paul S.

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Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films von Zhao, Jie-Hua, Ryan, Todd, Ho, Paul S., McKerrow, Andrew J., Shih, Wei-Yan

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Aggregation of squaraine dyes: Structure-property relationships and solvent effects von McKerrow, Andrew J, Buncel, Erwin, Kazmaier, Peter M

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The effect of elastic modulus on channel crack propagation in organosilicate glass films von Tsui, Ting Y., Griffin, A.J., Fields, Russell, Jacques, Jeannette M., McKerrow, Andrew J., Vlassak, Joost J.

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On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique von Zhao, Jie-Hua, Ryan, Todd, Ho, Paul S., McKerrow, Andrew J., Shih, Wei-Yan

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Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films von Zhao, Jie-Hua, Malik, Irfan, Ryan, Todd, Ogawa, Ennis T., Ho, Paul S., Shih, Wei-Yan, McKerrow, Andrew J., Taylor, Kelly J.

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Thin film interaction between low- k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer von Zeng, Yuxiao, Russell, Stephen W., McKerrow, Andrew J., Chen, Peijun, Alford, T.L.

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CHEMICAL VAPOR DEPOSITION OF SILICON NITRIDE USING A REMOTE PLASMA von MCKERROW, Andrew J, TANG, Shane, BHIMARASETTI, Gopinath

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Molecular modelling of photoactive pigments in the solid state: Investigations of polymorphism von McKerrow, Andrew J, Buncel, Erwin, Kazmaier, Peter M

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Advanced Metallization Conference 2001 Held in October von Mckerrow, Andrew J., Shacham-Diamand, Yosi

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Chemical vapor deposition of silicon nitride using a remote plasma von TANG, SHANE, MCKERROW, ANDREW J, BHIMARASETTI, GOPINATH

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Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test von Yong Xiang, Tsui, T.Y., Vlassak, J.J., McKerrow, A.J.

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Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect von Tsui, T.Y., Matz, P., Willecke, R., Zielinski, E., Tae Kim, Haase, G., McPherson, J., Singh, A., McKerrow, A.J.

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Effectiveness of Ti, TiN, Ta, TaN, and W2N as barriers for the integration of low- k dielectric hydrogen silsesquioxane von Zeng, Yuxiao, Russell, Stephen W., McKerrow, Andrew J., Chen, Linghui, Alford, T. L.

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Preparation and characterization of polyimide alternating copolymers incorporatingN,N?-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide) von McKerrow, Andrew J., Fox, Marye Anne, Leu, Jihperng, Ho, Paul S.

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Solvent-controlled aggregation of a photoconductive dye von BUNCEL, E, MCKERROW, A. J, KAZMAIER, P. M

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Plasma activated conformal dielectric film deposition von Sriram, Mandyam, Subramonium, Pramod, Rangarajan, Vishwanathan, van Schravendijk, Bart, Henri, Jon, Hausmann, Dennis, Kattige, Kirthi, Swaminathan, Shankar, McKerrow, Andrew J

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