Integrating Recent Land Cover Mapping Efforts to Update the National Gap Analysis Program's Species Habitat Map von McKerrow, A. J., Davidson, A., Earnhardt, T. S., Benson, A. L.

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Biogeochemical diversity along a riverside toposequence in arctic Alaska von Giblin, A. E., Nadelhoffer, K. J., Shaver, G. R., Laundre, J. A., McKerrow, A. J.

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Constraint Effects on Thin Film Channel Cracking Behavior von Tsui, Ting Y., McKerrow, Andrew J., Vlassak, Joost J.

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Fluorescence and Redox Activity of Probes Anchored through an Aminotrithiol to Polycrystalline Gold von Fox, Marye Anne, Whitesell, James K, McKerrow, Andrew J

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scientific foundations of habitat conservation plans: a quantitative assessment von Harding, E.K, Crone, E.E, Elderd, B.D, Hoekstra, J.M, McKerrow, A.J, Perrine, J.D, Regetz, J, Rissler, L.J, Stanley, A.G, Walters, E.L

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Use of Occupancy Models to Evaluate Expert Knowledge-based Species-Habitat Relationships von Iglecia, Monica N., Collazo, Jaime A., McKerrow, Alexa J.

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The effect of elastic modulus on channel crack propagation in organosilicate glass films von Tsui, Ting Y., Griffin, A.J., Fields, Russell, Jacques, Jeannette M., McKerrow, Andrew J., Vlassak, Joost J.

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The effect of water diffusion on the adhesion of organosilicate glass film stacks von Tsui, Ting Y., McKerrow, Andrew J., Vlassak, Joost J.

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Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films von Zhao, Jie-Hua, Ryan, Todd, Ho, Paul S., McKerrow, Andrew J., Shih, Wei-Yan

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Molecular modelling of photoactive pigments in the solid state: Investigations of polymorphism von McKerrow, Andrew J, Buncel, Erwin, Kazmaier, Peter M

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On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique von Zhao, Jie-Hua, Ryan, Todd, Ho, Paul S., McKerrow, Andrew J., Shih, Wei-Yan

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Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films von Zhao, Jie-Hua, Malik, Irfan, Ryan, Todd, Ogawa, Ennis T., Ho, Paul S., Shih, Wei-Yan, McKerrow, Andrew J., Taylor, Kelly J.

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Effects of silicon carbide composition on dielectric barrier Voltage Ramp and TDDB reliability performance von Tsui, T.Y., Willecke, R., McKerrow, A.J.

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Materials Issues and Characterization of Low-k Dielectric Materials von Ryan, E. Todd, McKerrow, Andrew J., Leu, Jihperng, Ho, Paul S.

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Preparation and characterization of polyimide alternating copolymers incorporating N,N′-bis-(4-anilino)-1,2,4,5-benzene bis(dicarboximide) von McKerrow, Andrew J., Fox, Marye Anne, Leu, Jihperng, Ho, Paul S.

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Aggregation of squaraine dyes: Structure-property relationships and solvent effects von McKerrow, Andrew J, Buncel, Erwin, Kazmaier, Peter M

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Solvent-controlled aggregation of a photoconductive dye von BUNCEL, E, MCKERROW, A. J, KAZMAIER, P. M

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Thin film interaction between low- k dielectric hydrogen silsesquioxane (HSQ) and Ti barrier layer von Zeng, Yuxiao, Russell, Stephen W., McKerrow, Andrew J., Chen, Peijun, Alford, T.L.

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Direct seed electroplating of copper on ruthenium liners von Akolkar, R., Indukuri, T., Clarke, J., Ponnuswamy, T., Reid, J., McKerrow, A. J., Varadarajan, S.

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Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test von Yong Xiang, Tsui, T.Y., Vlassak, J.J., McKerrow, A.J.

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