Printable electronics: towards materials development and device fabrication von Das, Rabindra N., Lin, How T., Lauffer, John M., Markovich, Voya R.

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Nano- and micro-filled conducting adhesives for z-axis interconnections: new direction for high-speed, high-density, organic microelectronics packaging von Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.

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Fabrication, integration and reliability of nanocomposite based embedded capacitors in microelectronics packaging von DAS, Rabindra N, LAUFFER, John M, MARKOVICH, Voya R

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Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging von Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.

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Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP) von Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Antesberger, Tim, Markovich, Voya R.

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Laser Micromachining of Barium Titanate (})-Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors von Das, R.N., Egitto, F.D., Lauffer, J.M., Markovich, V.R.

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Development of rigid-flex and multilayer flex for electronic packaging von Das, Rabindra N, Egitto, Frank D, Wilson, Bill, Poliks, Mark D, Markovich, Voya R

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Nanofluids, nanogels and nanopastes for electronic packaging von Das, Rabindra N, Calmidi, Varaprasad, Poliks, Mark D, Markovich, Voya R

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Resin coated copper capacitive RC3 nanocomposites for multilayer embedded capacitors towards system in a package SiP von Das, Rabindra N., Rosser, Steven G., Papathomas, Konstantinos I., Antesberger, Tim, Markovich, Voya R.

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Nano and microfilled conducting adhesives for zaxis interconnections new direction for highspeed, highdensity, organic microelectronics packaging von Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.

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Laser Micromachining of NANOCOMPOSITE-BASED Flexible Embedded Capacitors von Das, Rabindra N, Egitto, Frank D, Lauffer, John M, Markovich, Voya R

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Method of making a circuitized substrate von Das Rabindra N, Papathomas Kostas I, Markovich Voya R

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Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization [Nanopackaging von Das, Rabindra, Markovich, Voya

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Method of making a multi-chip electronic package having laminate carrier von Fraley, Lawrence R, Markovich, Voya

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Method of making a multi-chip electronic package having laminate carrier von FRALEY LAWRENCE R, MARKOVICH VOYA

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Semi-conductor chip with compressible contact structure and electronic package utilizing same von Lin, How, Egitto, Frank, Markovich, Voya

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Semi-conductor chip with compressible contact structure and electronic package utilizing same von EGITTO FRANK, MARKOVICH VOYA, LIN HOW

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Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics von Das, R. N., Egitto, F. D., Bonitz, B., Poliks, M. D., Markovich, V. R.

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SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME von EGITTO FRANK, MARKOVICH VOYA, LIN HOW

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Coreless layer buildup structure with LGA and joining layer von WILSON WILLIAM, MARKOVICH VOYA, DAS RABINDRA N, EGITTO FRANK D, ANTESBERGER TIMOTHY

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