Design of Wafer Level Solder Seals – A Surface Energy Perspective von Marinis, Thomas F., Soucy, Joseph W.

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Packaging Design and Assembly for Ultrahigh Energy Density Microbatteries von Bjune, Caroline K., Marinis, Thomas F., Chiang, Yet-Ming

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Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation von Bjune, Caroline K., Marinis, Thomas F., Sriram, Tirunelveli S., Brady, Jeanne M., Moran, James, Parks, Philip D., Widge, Alik S., Dougherty, Darin D., Eskandar, Emad N.

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Ultrahigh Energy Density Rechareable Microbatteries von Lai, Wei, Erdonmez, Can, Marinis, Thomas F. F., Bjune, Caroline K, Dudney, Nancy J, Xu, Fan, Wartena, Ryan, Chiang, Yet-Ming

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Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler von Dytiuk, Nina S., Marinis, Thomas F., Soucy, Joseph W.

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Design of Solder Connections for Self-Assembly of Optoelectronic Devices von Marinis, Thomas F., Soucy, Joseph W.

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Control of Void Formation in Adhesively Bonded Joints von Dytiuk, Nina S., Marinis, Thomas F., Soucy, Joseph W.

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Multichip Module Planarity Requirements Derived From Solder Surface Tension Models von Marinis, Thomas F., Soucy, Joseph W.

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Design of a Miniaturized Vibrating Beam Power Converter von Marinis, Thomas F., Soucy, Joseph W.

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Implementing Inductor Function with Vibrating Capacitor Structures von Marinis, Thomas F., Soucy, Joseph W.

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Packaging Design and Assembly for Ultrahigh Energy Density Microbatteries von Bjune, Caroline K., Marinis, Thomas F., Chiang, Yet-Ming

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Response of Long Sculpted Wire Bonds to Vibrational Excitation von Marinis, Thomas F., Soucy, Joseph W.

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Development of packaging for MEMS inertial sensors von Pryputniewicz, R.J., Marinis, T.F., Soucy, J.W., Furlong, C.

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Methods and apparatus for mounting a crystal von MARINIS THOMAS F, BJUNE CAROLINE K

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Design and characterization of wirebonds for use in high shock environments von Marinis, T.F., Soucy, J.W.

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METHODS AND APPARATUS FOR MOUNTING A CRYSTAL von MARINIS THOMAS F, BJUNE CAROLINE K

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Vacuum sealed MEMS package with an optical window von Marinis, T.F., Soucy, J.W., Lawrence, J.G., Marinis, R.T., Pryputniewicz, R.J.

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Removal of integrated circuits from packages von MARINIS THOMAS F, TEPOLT GARY B, PRYPUTNIEWICZ DARIUSZ R

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Removal of integrated circuits from packages von Pryputniewicz, Dariusz R, Marinis, Thomas F, Tepolt, Gary B

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Structures and methods for crystal packaging von CAROLINE A. KONDOLEON, DARIUSZ R. PRYPUTNIEWICZ, THOMAS F. MARINIS

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