On-Demand Infrared Laser Sintering of Gold Nanoparticle Paste for Electrical Contacts von Yamaguchi, Mitsugu, Araga, Shinji, Mita, Mamoru, Yamasaki, Kazuhiko, Maekawa, Katsuhiro

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Terahertz path-length lens composed of oblique metal slit array von Togashi, Takahisa, Kitahara, Hideaki, Takano, Keisuke, Hangyo, Masanori, Mita, Mamoru, Young, John C., Suzuki, Takehito

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Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components von Yamaguchi, Mitsugu, Miyagi, Nobuyuki, Mita, Mamoru, Yamasaki, Kazuhiko, Maekawa, Katsuhiro

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Modified imprinting process using hollow microneedle array for forming through holes in polymers von Shibata, Takayuki, Yukizono, Satoshi, Kawashima, Takahiro, Nagai, Moeto, Kubota, Toshio, Mita, Mamoru

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Thick Copper Wiring on Liquid Crystal Polymer Substrate by Nd:YVO4 Green Laser Irradiation von SONODA, Hisaya, OHASHI, Shota, MITA, Mamoru, MAEKAWA, Katsuhiro, YAMASAKI, Kazuhiko

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Micromachining of electroformed nickel mold using thick photoresist microstructure for imprint technology von Shibata, Takayuki, Takahashi, Yoichi, Kawashima, Takahiro, Kubota, Toshio, Mita, Mamoru, Mineta, Takashi, Makino, Eiji

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Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging von Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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High-Speed Laser Plating for Wire-Bonding Pad Formation von Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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Direct polymer-transfer lithography for high-throughput fabrication of Cu line patterns von Shibata, Takayuki, Kawashima, Takahiro, Kubota, Toshio, Mita, Mamoru

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Laser Sintering of Silver Nanoparticles for Electronic Use von Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Maekawa, Katsuhiro, Saito, Hiroshi

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Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources von MITA, Mamoru

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Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources von MITA, Mamoru

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High-speed laser plating on Cu leadframe using Ag nanoparticles von Maekawa, Katsuhiro, Yamasaki, Kazuhiko, Niizeki, Tomotake, Mita, Mamoru, Matsuba, Yorishige, Terada, Nobuto, Saito, Hiroshi

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Nd:YVO4 グリーンレーザを用いた液晶高分子基板への銅厚膜配線形成 von 園田, 久也, 大橋, 翔太, 御田, 護, 前川, 克廣, 山崎, 和彦

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Influence of wavelength on laser sintering characteristics of Ag nanoparticles von Maekawa, K., Yamasaki, K., Niizeki, T., Mita, M., Matsuba, Y., Terada, N., Saito, H.

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Brittle Properties of Copper Base Lead Frame at Soldered Joint von HARAMAKI, Takashi, NAKAMURA, Mitsuo, MITA, Mamoru

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Measurement of a Terahertz Wire-Grid Polarizer to Realize High Extinction Ratio Less Than -50 dB and High Transmission Power More Than 80 von Kishi, Yudai, Nagai, Masaya, Mita, Mamoru, Takano, Keisuke, Hangyo, Masanori, Suzuki, Takehito

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Focusing Effect Measurement of Terahertz Wave by Three-dimensional Concave Lens Composed of Metal Hollow Slit Array with Effective Refractive Index n=0.5 von Kimura, Tatsuya, Kitahara, Hideaki, Takano, Keisuke, Hangyo, Masanori, Mita, Mamoru, Togashi, Takahisa, Suzuki, Takehito

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Reliability of Microsoldered Thin Copper-lead by Low Melting Point Au/Sn Microsoldering: A Study on Microjoining of Leadframe for LSI Package (No.5) von MITA, Mamoru, SHIDA, Tomohiko

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Characteristics of Au-Sn Microsoldered Layer of the TCP Outer Lead Connection: A Study on Microjoining of Leadframe for LSI Package (No.4) von MITA, Mamoru, KUMAKURA, Toyohiko

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