TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O von Wade, Mark, Anderson, Erik, Ardalan, Shahab, Bhargava, Pavan, Buchbinder, Sidney, L. Davenport, Michael, Fini, John, Lu, Haiwei, Li, Chen, Meade, Roy, Ramamurthy, Chandru, Rust, Michael, Sedgwick, Forrest, Stojanovic, Vladimir, Van Orden, Derek, Zhang, Chong, Sun, Chen, Shumarayev, Sergey Y., O'Keeffe, Conor, Hoang, Tim T., Kehlet, David, Mahajan, Ravi V., Guzy, Matthew T., Chan, Allen, Tran, Tina

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In Memoriam Prof. Avram Bar-Cohen von Hodes, Marc S., Kim, Kyoung Joon, Arik, Mehmet, Mahajan, Ravi V., Ramakrishna, Koneru

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In Memoriam Prof. Avram Bar-Cohen von Hodes, Marc S., Iyengar, Madhusudan, Arik, Mehmet, Kim, Kyoung Joon, Spector, Mark, Bhavnani, Sushil H., Joshi, Yogendra K., Mahajan, Ravi V., Ramakrishna, Koneru

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Advanced packaging of chiplets for future computing needs von Das Sharma, Debendra, Mahajan, Ravi V.

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In Memoriam - A Tribute: Prof. Avram Bar-Cohen von Joshi, Yogendra K., Bhavnani, Sushil H., Ohadi, Michael M., Spector, Mark, Iyengar, Madhusudhan K., Mahajan, Ravi V., Ramakrishna, Koneru

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A Tribute: Prof. Avram Bar-Cohen von Joshi, Yogendra K, Bhavnani, Sushil H, Ohadi, Michael M, Spector, Mark, Iyengar, Madhusudhan K, Mahajan, Ravi V, Koneru Ramakrishna

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Towards a Thermal Moore's Law von Krishnan, S., Garimella, S.V., Chrysler, G.M., Mahajan, R.V.

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ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES von DESHPANDE, Nitin, MAHAJAN, Ravi V

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ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES von DESHPANDE, Nitin, MAHAJAN, Ravi V

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LOCALIZED HIGH DENSITY SUBSTRATE ROUTING von MALLIK, Debendra, KULKARNI, Deepak, MAHAJAN, Ravi V, STARKSTON, Robert, GUZEK, John S, CHIU, Chia-Pin

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Localized high density substrate routing von Mahajan, Ravi V, Starkston, Robert, Chiu, Chia-Pin, Kulkarni, Deepak, Mallik, Debendra, Guzek, John S

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Localized high density substrate routing von Mahajan, Ravi V, Starkston, Robert, Chiu, Chia-Pin, Kulkarni, Deepak, Mallik, Debendra, Guzek, John S

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Critical Aspects of High-Performance Microprocessor Packaging von Atluri, Vasudeva P., Mahajan, Ravi V., Patel, Priyavadan R., Mallik, Debendra, Tang, John, Wakharkar, Vijay S., Chrysler, Gregory M., Chiu, Chia-Pin, Choksi, Gaurang N., Viswanath, Ram S.

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ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES von DESHPANDE, Nitin, MAHAJAN, Ravi V

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Electronic assembly that includes stacked electronic devices von Deshpande Nitin, Mahajan Ravi V

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LOCALIZED HIGH DENSITY SUBSTRATE ROUTING von MALLIK, Debendra, KULKARNI, Deepak, MAHAJAN, Ravi V, STARKSTON, Robert, GUZEK, John S, CHIU, Chia-Pin

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LOCALIZED HIGH DENSITY SUBSTRATE ROUTING von MALLIK, Debendra, KULKARNI, Deepak, MAHAJAN, Ravi V, STARKSTON, Robert, GUZEK, John S, CHIU, Chia-Pin

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Localized high density substrate routing von Mahajan, Ravi V, Starkston, Robert, Chiu, Chia-Pin, Kulkarni, Deepak, Mallik, Debendra, Guzek, John S

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ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES von DESHPANDE, Nitin, MAHAJAN, Ravi V

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ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES von Deshpande Nitin, Mahajan Ravi V

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