Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process von Abas, Aizat, M.S., Haslinda, Ishak, M.H.H., A.S., Nurfatin, Abdullah, M.Z., Che Ani, F.

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Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages von Haslinda, M.S., Abas, Aizat, Che Ani, F., Jalar, A., Saad, A.A., Abdullah, M.Z.

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Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO 2 nano-reinforced lead free solder at different weighted percentages von Haslinda, M.S., Abas, Aizat, Che Ani, F., Jalar, A., Saad, A.A., Abdullah, M.Z.

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Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305) von M.Mukhtar, M.A.Fatah, Abas, Aizat, Haslinda, M.S, Ani, F. Che, Abdullah, M. Z., Jalar, A., Ismail, R.

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A generic framework for developing map-based mobile application von Harun, H., Jailani, N., Bakar, M.A., Zakaria, M.S., Abdullah, S.

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