Range imaging for autonomous navigation of robotic land vehicles von Lux, P.W., Schaefer, C.H.

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Chemical and structural modifications in a 193-nm photoresist after low- k dry etch von Kesters, E., Claes, M., Le, Q.T., Lux, M., Franquet, A., Vereecke, G., Mertens, P.W., Frank, M.M., Carleer, R., Adriaensens, P., Biebuyk, J.J., Bebelman, S.

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Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects von Mertens, P.W., Kim, T.-G., Claes, M., Le, Q.T., Vereecke, G., Kesters, E., Suhard, S., Pacco, A., Lux, M., Kenis, K., Urbanowicz, A., Tokei, Z., Beyer, G.

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A novel resist and post-etch residue removal process using ozonated chemistries von De Gendt, S., Snee, P., Cornelissen, I., Lux, M., Vos, R., Mertens, P.W., Knotter, D.M., Heyns, M.M.

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Cost-effective cleaning for advanced Si-processing von Heyns, M.M., Bearda, T., Cornelissen, I., De Gendt, S., Knotter, D.M., Loewenstein, L.M., Lux, M., Mertens, P.W., Mertens, S., Meuris, M., Schaekers, M., Snee, P., Teerlinck, I., Vos, R.

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