Treffer 1 - 8 von 8 für Suche 'Lutzke, Melanie', Suchdauer: 0,48s Treffer weiter einschränken
  1. 1
    Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

    Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer von KRONINGER WERNER, LUTZKE MELANIE, HECHT FRANZ

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  2. 2
    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer von LUTZKE MELANIE, HECHT FRANZ, KROENINGER WERNER

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  3. 3
    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer von Hecht, Franz, Kröninger, Werner, Lutzke, Melanie

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  4. 4
    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer von Kroninger, Werner, Hecht, Franz, Lutzke, Melanie

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  5. 5
    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

    Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer von KRONINGER WERNER, LUTZKE MELANIE, HECHT FRANZ

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  6. 6
    Device for planar joining of two wafers e.g. for thin grinding and separation of product-wafer, has product wafer arranged surface-congruently over carrier wafer

    Device for planar joining of two wafers e.g. for thin grinding and separation of product-wafer, has product wafer arranged surface-congruently over carrier wafer von KROENINGER, WERNER, HECHT, FRANZ, LUTZKE, MELANIE

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  7. 7
    DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT

    DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT von KROENINGER, WERNER, HECHT, FRANZ, LUTZKE, MELANIE

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  8. 8
    DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT

    DEVICE AND METHOD FOR THE PLANAR CONNECTION OF TWO WAFERS FOR A THIN-GRINDING AND SEPARATION PROCESS OF A WAFER PRODUCT von KROENINGER, WERNER, HECHT, FRANZ, LUTZKE, MELANIE

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:

Suchwerkzeuge: