Treffer 1 - 8 von 8 für Suche 'Luehn, Ole', Suchdauer: 0,43s Treffer weiter einschränken
  1. 1
    Leveling of Microvias by Electroplating for Wafer Level Packaging

    Leveling of Microvias by Electroplating for Wafer Level Packaging von Luehn, Ole, Celis, Jean-Pierre, Van Hoof, Chris, Baert, Kris, Ruythooren, Wouter


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  2. 2
    (Invited) Through-Silicon Via Technology for 3D Applications

    (Invited) Through-Silicon Via Technology for 3D Applications von Philipsen, Harold G., Lühn, Ole, Civale, Yann, Wang, Yu-Shuen, Sabuncuoglu Tezcan, Deniz, Ruythooren, Wouter


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  3. 3
    Method for forming a metallic conductor structure

    Method for forming a metallic conductor structure von LUEHN, OLE

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  4. 4
    Method used for forming metallic conductor structure

    Method used for forming metallic conductor structure von LUEHN OLE

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  5. 5
    Forming metallic conductor pattern on surface of substrate made of semiconductor material, comprises providing discrete textured areas of semiconductor material, and carrying out galvanic deposition of metallic seed layer and metal layer

    Forming metallic conductor pattern on surface of substrate made of semiconductor material, comprises providing discrete textured areas of semiconductor material, and carrying out g... von LUEHN, OLE

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  6. 6
    Novel Front Side MetallizationPprocesses for Silicon based Solar Cells

    Novel Front Side MetallizationPprocesses for Silicon based Solar Cells von Bund, Andreas, Fritz, Mathias, Schmidt, Udo, Luehn, Ole, Kuehnlein, Holger


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  7. 7
    Leveling of microvias for Wafer Level Packaging

    Leveling of microvias for Wafer Level Packaging von Luehn, Ole, Celis, Jean-Pierre, Van Hoof, Chris, Baert, Kris, Ruythooren, Wouter


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  8. 8
    Copper Plating for 3D Interconnects

    Copper Plating for 3D Interconnects von Radisic, Aleksandar, Lühn, Ole, Vaes, Jan, Armini, Silvia, El-Mekki, Zaid, Radisic, Dunja, Ruythooren, Wouter, Vereecken, Philippe M.


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