RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis von Cheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun

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Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions von Chen, Lei, Wen, Jialin, Zhang, Peng, Yu, Bingjun, Chen, Cheng, Ma, Tianbao, Lu, Xinchun, Kim, Seong H., Qian, Linmao

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Chemical mechanical polishing: Theory and experiment von Zhao, Dewen, Lu, Xinchun

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Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers von Zhang, Lifei, Wang, Tongqing, Lu, Xinchun

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Long-term application of fertilizer and manures affect P fractions in Mollisol von Lu, Xinchun, Mahdi, Al-Kaisi, Han, Xiao-zeng, Chen, Xu, Yan, Jun, Biswas, Asim, Zou, Wen-xiu

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Nanotribological Study of Supramolecular Template Networks Induced by Hydrogen Bonds and van der Waals Forces von Shi, Hongyu, Lu, Xinchun, Liu, Yuhong, Song, Jian, Deng, Ke, Zeng, Qingdao, Wang, Chen

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Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing von Wang, Zhenyang, Wang, Tongqing, Zhang, Lifei, Lu, Xinchun

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Effect of photocatalytic oxidation technology on GaN CMP von Wang, Jie, Wang, Tongqing, Pan, Guoshun, Lu, Xinchun

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Tribochemistry and Superlubricity Induced by Hydrogen Ions von Li, Jinjin, Zhang, Chenhui, Sun, Liang, Lu, Xinchun, Luo, Jianbin

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Atomistic mechanisms of Si chemical mechanical polishing in aqueous H2O2: ReaxFF reactive molecular dynamics simulations von Wen, Jialin, Ma, Tianbao, Zhang, Weiwei, van Duin, Adri C.T., Lu, Xinchun

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A Review of Capacity Allocation and Control Strategies for Electric Vehicle Charging Stations with Integrated Photovoltaic and Energy Storage Systems von Yao, Ming, Da, Danning, Lu, Xinchun, Wang, Yuhang

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Labile organic carbon fractions drive soil microbial communities after long-term fertilization von Zhang, Zhiming, Yan, Jun, Han, Xiaozeng, Zou, Wenxiu, Chen, Xu, Lu, Xinchun, Feng, Yutian

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Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing von Tian, Fangxin, Wang, Tongqing, Lu, Xinchun

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Keystone Microbiomes Revealed by 14 Years of Field Restoration of the Degraded Agricultural Soil Under Distinct Vegetation Scenarios von Zhang, Zhiming, Han, Xiaozeng, Yan, Jun, Zou, Wenxiu, Wang, Entao, Lu, Xinchun, Chen, Xu

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Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing von Zheng, Pengjie, Zhao, Dewen, Lu, Xinchun

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Effect of ionic surfactants on shallow trench isolation for chemical mechanical polishing using ceria-based slurries von Zhang, Lifei, Xie, Lile, Lu, Xinchun

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Signal processing and analysis for copper layer thickness measurement within a large variation range in the CMP process von Li, Hongkai, Zhao, Qian, Lu, Xinchun, Luo, Jianbin

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Chemical roles on Cu-slurry interface during copper chemical mechanical planarization von Li, Jing, Liu, Yuhong, Pan, Yan, Lu, Xinchun

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Chemical effects on the tribological behavior during copper chemical mechanical planarization von Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun

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Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate von Xu, Wenhu, Lu, Xinchun, Pan, Guoshun, Lei, Yuanzhong, Luo, Jianbin

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