Thermally activated solvent bonding of polymers von Ng, S. H., Tjeung, R. T., Wang, Z. F., Lu, A. C. W., Rodriguez, I., de Rooij, N. F.

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Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate von Zhong, Z.W, Arulvanan, P, Phone Maw, Hla, Lu, C.W.A

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Planar waveguide devices based on sol–gel-derived photopatternable hybrid material von Zhang, X., Zhao, Z., Qian, M., Lee, S.Y., Chin, M.K., Zeng, X., Low, D.K.Y., Lu, A.C.W., Plante, P.

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Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers von Wang, J.J., Zhang, Y.P., Kai Meng Chua, Lu, A.C.W.

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Miniaturized Multilayer UWB Antennas on LTCC von Kah-Wee Khoo, Zhi Ning Chen, Lu, A.C.W., Sunappan, V., Lai Lai Wai

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Hybrid analytical modeling method for split power bus in multilayered package von Youchul Jeong, Lu, A.C.W., Wai, L.L., Wei Fan, Lok, B.K., Hyunjeong Park, Kim, Joungho

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Hydrothermal growth of BaTiO3 thin films on printed circuit boards for integral capacitor applications von TAN, C. K, GOH, Gregory K. L, CHI, D. Z, LU, Albert C. W, LOK, B. K

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Frequency-band selection for an integrated-circuit package antenna using LTCC technology von Wang, J. J., Xue, Y., Zhang, Y. P., Chua, K. M., Lu, A. C. W., Wai, Lai L., Wong, C. K.

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Roll-to-roll (R2R) hot embossing for structuring 3D microstructures on polymer films von Shan, X. C., Mohahidin, M. B., Lu, A. C. W.

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A flexible modified dipole antenna printed on PET film von Lei Wang, Yong-Xin Guo, Salam, B., Lu, C. W. A.

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Formation of large format functional films via roll-to-roll (R2R) ultraviolet (UV) embossing von Shan, X. C., Lau, S. K., Mohahidin, M. B., Liu, T., Lu, A. C. W.

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Full-wave modeling and analysis of screen printed EMI shield von Wang, L B, See, K Y, Zhang, J W, Lu, A C W, Ng, S T

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Processing and characterization of flexographic printed conductive grid von Lok Boon Keng, Wai Lai Lai, Lu, C. W. A., Salam, B.

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Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications von Ng, Y.T., Wai, L.L., Fan, W., Gian, P.W., Lu, H., Lu, A.C.W.

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Formation of Embedded Microstructures by Thermal Activated Solvent Bonding von Ng, S. H, Tjeung, R. T, Wang, Z. F, Lu, A. C. W, Rodriguez, I, De Rooij, N

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Formation of Embedded Microstructures by Thermal Activated Solvent Bonding von Ng, S H, Tjeung, R T, Wang, Z F, Lu, A C W, Rodriguez, I, De Rooij, N

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Carbamazepine-Induced Toxic Effects and HLA-B1502 Screening in Taiwan von Chen, Pei, Chen, Chien-Hsiun, Chen, Ying-Ju, Chen, Yuan-Tsong, Chen, Luke, Lin, Shu-Yi, Lin, Juei-Jueng, Lin, Yu-Hsuan, Lu, Chung-Ta, Lu, Chin-Song, Lu, Cheng-Hsien, Ong, Cheung-Ter, Hsieh, Peiyuan F, Yang, Chih-Chao, Tai, Chih-Ta, Wu, Jer-Yuarn, Wu, Shey-Lin, Hsu, Yung-Chu, Yu, Hsiang-Yu, Ro, Long-Sun, Chu, Chun-Che, Tsai, Pei-Joung, Tsai, Jing-Jane, Su, Yu-Hsiang, Lan, Sheng-Hsing, Sung, Sheng-Feng, Chuang, Hui-Ping, Huang, Li-Chen, Liao, Hung-Ting, Chung, Wen-Hung, Hung, Shuen-Iu, Chang, Chi-Feng, Shen, Chen-Yang

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Dual heterogeneous structures lead to ultrahigh strength and uniform ductility in a Co-Cr-Ni medium-entropy alloy von Du, X. H., Li, W. P., Chang, H. T., Yang, T., Duan, G. S., Wu, B. L., Huang, J. C., Chen, F. R., Liu, C. T., Chuang, W. S., Lu, Y., Sui, M. L., Huang, E. W.

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Neuropsychiatric symptoms in Alzheimer's disease: associations with caregiver burden and treatment outcomes von Chen, C T, Chang, C-C, Chang, W-N, Tsai, N-W, Huang, C-C, Chang, Y-T, Wang, H-C, Kung, C-T, Su, Y-J, Lin, W-C, Cheng, B-C, Su, C-M, Hsiao, S-Y, Hsu, C-W, Lu, C-H

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Trends in the susceptibility of methicillin-resistant Staphylococcus aureus to nine antimicrobial agents, including ceftobiprole, nemonoxacin, and tyrothricin: results from the Tig... von Chen, Y.-H., Liu, C.-Y., Ko, W.-C., Liao, C.-H., Lu, P.-L., Huang, C.-H., Lu, C.-T., Chuang, Y.-C., Tsao, S.-M., Chen, Y.-S., Liu, Y.-C., Chen, W.-Y., Jang, T.-N., Lin, H.-C., Chen, C.-M., Shi, Z.-Y., Pan, S.-C., Yang, J.-L., Kung, H.-C., Liu, C.-E., Cheng, Y.-J., Liu, J.-W., Sun, W., Wang, L.-S., Yu, K.-W., Chiang, P.-C., Lee, M.-H., Lee, C.-M., Hsu, G.-J., Hsueh, P.-R.

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