Drop impact reliability testing for lead-free and lead-based soldered IC packages von Chong, Desmond Y.R., Che, F.X., Pang, John H.L., Ng, Kellin, Tan, Jane Y.N., Low, Patrick T.H.

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Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages von Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.

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Drop test reliability assessment of leaded & lead-free solder joints for IC packages von Chong, D.Y.R., Ng, K., Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X.

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