An overview to integrated power module design for high power electronics packaging von Lostetter, A.B., Barlow, F., Elshabini, A.

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Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments von Hornberger, J., Lostetter, A.B., Olejniczak, K.J., McNutt, T., Lal, S.M., Mantooth, A.

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Ultra-lightweight, high efficiency SiC based power electronic converters for extreme environments von Mounce, S., McPherson, B., Schupbach, R., Lostetter, A.B.

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A reconfigurable fault-tolerant multi module converter system utilizing HTSOI and SiC technology von Mitchell, G., Cilio, E., Reese, B.A., Schupbach, R.M., Lostetter, A.B.

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High-temperature silicon carbide (SiC) power switches in multichip power module (MCPM) applications von Homberger, J.M., Mounce, S.D., Schupbach, R.M., Lostetter, A.B., Mantooth, H.A.

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Model-based design tools for extending COTS components to extreme environments von Mantooth, H.A., Levy, A., Francis, A.M., Cilioq, E.S., Lostetter, A.B.

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Compact modeling of environmentally induced radiation effects on electrical devices von Huang, X., Francis, A.M., Lostetter, A.B., Mantooth, H.A.

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A Fully Integrated 300°C, 4 kW, 3-Phase, SiC Motor Drive Module von Hornberger, J.M., Cilio, E., McPherson, B., Schupbach, R.M., Lostetter, A.B.

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Packaging of High Frequency, High Temperature Silicon Carbide (SiC) Multichip Power Module (MCPM) Bi-directional Battery Chargers for Next Generation Hybrid Electric Vehicles von Cole, Z., Passmore, B., Whitaker, B., Barkley, A., McNutt, T., Lostetter, A.B.

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Evaluation of gold and aluminum wire bond performance for high temperature (500 /spl deg/C) silicon carbide (SiC) power modules von Mustain, H.A., Lostetter, A.B., Brown, W.D.

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High-temperature integration of silicon carbide (SiC) and silicon-on-insulator (SOI) electronics in multichip power modules (MCPMs) von Hornberger, J., Mounce, S., Schupbach, R., McPherson, B., Mustain, H., Mantooth, A., Brown, W., Lostetter, A.B.

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Polymer thick film (PTF) and flex technologies for low cost power electronics packaging von Lostetter, A.B., Barlow, F., Elshabini, A., Olejniczak, K., Ang, S.

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Modeling vertical channel junction field effect devices in silicon carbide von Kashyap, A.S., Ramavarapu, P.L., Maganlal, S., McNutt, T.R., Lostetter, A.B., Mantooth, H.A.

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Compact circuit simulation model of silicon carbide static induction and junction field effect transistors von Kashyap, A.S., Ramavarapu, P.L., Lal, S.M., McNutt, T.R., Lostetter, A.B., Funaki, T., Mantooth, H.A.

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