Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm) von Zhang, Liang, Liu, Zhi-quan

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Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength von Pan, Hucheng, Qin, Gaowu, Huang, Yunmiao, Ren, Yuping, Sha, Xuechao, Han, Xiaodong, Liu, Zhi-Quan, Li, Caifu, Wu, Xiaolei, Chen, Houwen, He, Cong, Chai, Linjiang, Wang, Yunzhi, Nie, Jian-feng

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SiO2@C hollow sphere anodes for lithium-ion batteries von Liu, Xuelian, Chen, Yuxi, Liu, Hongbo, Liu, Zhi-Quan

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Reliability issues of lead-free solder joints in electronic devices von Jiang, Nan, Zhang, Liang, Liu, Zhi-Quan, Sun, Lei, Long, Wei-Min, He, Peng, Xiong, Ming-Yue, Zhao, Meng

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Structure and properties of Sn-Cu lead-free solders in electronics packaging von Zhao, Meng, Zhang, Liang, Liu, Zhi-Quan, Xiong, Ming-Yue, Sun, Lei

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Review of Large Spacecraft Deployable Membrane Antenna Structures von Liu, Zhi-Quan, Qiu, Hui, Li, Xiao, Yang, Shu-Li

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Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor von Gao, Li-Yin, Liu, Zhi-Quan

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Boosting Li ion kinetics in H–Co3O4@CNT electrode by synergic design of CNT coating and hollow structure von Zhang, Qi, Liu, Yinan, Zheng, Yun, Guo, Yan, Huang, Yike, He, Liqing, Zhao, Huajun, Li, Zhe, Shen, Jingjun, Xu, Jincheng, Shen, Yingying, Zhang, Hebin, Guo, Junpo, Liu, Zhi-Quan, Shao, Huaiyu

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Materials, processing and reliability of low temperature bonding in 3D chip stacking von Zhang, Liang, Liu, Zhi-quan, Chen, Sinn-Wen, Wang, Yao-dong, Long, Wei-Min, Guo, Yong-huan, Wang, Song-quan, Ye, Guo, Liu, Wen-yi

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Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling von Chen, Yinbo, Wang, Changchang, Gao, Yue, Gao, Zhaoqing, Liu, Zhi-Quan

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Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging von Chen, Ke-Xin, Gao, Li-Yin, Li, Zhe, Sun, Rong, Liu, Zhi-Quan

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Sweet Sorghum Originated through Selection of Dry, a Plant-Specific NAC Transcription Factor Gene von Zhang, Li-Min, Leng, Chuan-Yuan, Luo, Hong, Wu, Xiao-Yuan, Liu, Zhi-Quan, Zhang, Yu-Miao, Zhang, Hong, Xia, Yan, Shang, Li, Liu, Chun-Ming, Hao, Dong-Yun, Zhou, Yi-Hua, Chu, Cheng-Cai, Cai, Hong-Wei, Jing, Hai-Chun

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SbHKT1;4, a member of the high-affinity potassium transporter gene family from Sorghum bicolor, functions to maintain optimal Na＋/K＋ balance under Na＋ stress von Wang, Tian‐Tian, Ren, Zhi‐Jie, Liu, Zhi‐Quan, Feng, Xue, Guo, Rui‐Qi, Li, Bao‐Guo, Li, Le‐Gong, Jing, Hai‐Chun

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Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors von Gao, Yue, Xiao, Yu-bo, Liu, Zhi-Quan, Liu, Yang, Sun, Rong

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Improving Electromigration Resistance of Fine‐Pitch Redistributed Layer Using Graphene‐Doped Twinned Copper Composites von Shi, Zixiang, Wang, ZeSong, Gao, Li‐Yin, Zhong, Cheng, Li, Peifeng, Liu, Zhi‐Quan, Sun, Rong

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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints von Chen, Yinbo, Meng, Zhi-Chao, Gao, Li-Yin, Liu, Zhi-Quan

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Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder von Jiang, Nan, Zhang, Liang, Liu, Zhi-quan, Sun, Lei, Xiong, Ming-yue, Zhao, Meng, Xu, Kai-kai

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Effects of salinity acclimation on the growth performance, osmoregulation and energy metabolism of the oriental river prawn, Macrobrachium nipponense (De Haan) von Huang, You‐Hui, Zhang, Meng, Li, Yi‐Ming, Wu, Dong‐Lei, Liu, Zhi‐Quan, Jiang, Qi‐Chen, Zhao, Yun‐Long

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Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters von ROBERTSON, STUART, DOAK, SCOTT, SUN, FU‐LONG, LIU, ZHI‐QUAN, LIU, CHANGQING, ZHOU, ZHAOXIA

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Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging von Liu, Jin‐Hao, Wan, Yong‐Qiang, Gao, Li‐Yin, Cui, Xian‐Wei, Liu, Zhi‐Quan

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