Investigation on evolution mechanisms of site-specific grain structures during metal additive manufacturing von Liu, P.W., Ji, Y.Z., Wang, Z., Qiu, C.L., Antonysamy, A.A., Chen, L.-Q., Cui, X.Y., Chen, L.

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Integration of phase-field model and crystal plasticity for the prediction of process-structure-property relation of additively manufactured metallic materials von Liu, P.W., Wang, Z., Xiao, Y.H., Lebensohn, R.A., Liu, Y.C., Horstemeyer, M.F., Cui, X.Y., Chen, L.

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La2O3 addition for improving the brazed joints of WC-Co/1Cr13 von Xiao, Y.H., Liu, P.W., Wang, Z., Wang, Y., Feng, K.Q., Chen, L.

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Texture evolution of cholesteric liquid crystal driven by a thermal process von Lin, H.K., Huang, Y.F., Chen, A.C., Liu, P.W.

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Hydrogen transport and degradation of a commercial duplex stainless steel von Luu, W.C, Liu, P.W, Wu, J.K

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Public mental health problems during COVID-19 pandemic: a large-scale meta-analysis of the evidence von Liu, X.R., Zhu, M.Y., Zhang, J.X., Liu, P.W., Feng, Z.Z., Chen, Z.Y.

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Identification of AFLP markers linked to the epistatic suppressor gene of a recessive genic male sterility in rapeseed and conversion to SCAR markers von Xie, Y.Z, Hong, D.F, Xu, Z.H, Liu, P.W, Yang, G.S

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Development of Polima temperature-sensitive cytoplasmic male sterile lines of Brassica napus through isolated microspore culture von Yang, L.Y, Liu, P.W, Yang, G.S

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A new observation of strain-induced slow traps in advanced CMOS technology with process-induced strain using random telegraph noise measurement von Lin, M.H., Hsieh, E.R., Chung, S.S., Tsai, C.H., Liu, P.W., Lin, Y.H., Tsai, C.T., Ma, G.H.

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Hydrogen susceptibility of an interstitial free steel von Liu, P.W, Wu, J.K

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Development and primary genetic analysis of a fertility temperature-sensitive polima cytoplasmic male sterility restorer in Brassica napus von Fan, Z.X, Lei, W.X, Hong, D.F, He, J.P, Wan, L.L, Xu, Z.H, Liu, P.W, Yang, G.S

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Design of high-performance and highly reliable nMOSFETs with embedded Si:C S/D extension stressor(Si:C S/D-E) von Chung, S.S., Hsieh, E.R., Liu, P.W., Chiang, W.T., Tsai, S.H., Tsai, T.L., Huang, R.M., Tsai, C.H., Teng, W.Y., Li, C.I., Kuo, T.F., Wang, Y.R., Yang, C.L., Tsai, C.T., Ma, G.H., Chien, S.C., Sun, S.W.

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18.3 Superior Current Enhancement in SiGe Channel p-MOSFETs Fabricated on [110] Surface von Liu, P.W., Pan, J., Chang, T., Tsai, T.L., Chen, T., Liu, Y.C., Tsai, C.H., Lan, B., Lin, Y., Chiang, W., Tsai, C.T.

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Circuit Performance Optimization in Advanced PD-SOI CMOS Development von Chiang, W.T., Huang, Y.T., Liu, P.W., Wu, C.H., Su, C.M., Huang, Y.S., Tsai, C.H., Laplanche, Y., Pelloie, J.-L., Tsai, C.T., Ma, G.H.

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65nm CMOS BULK to SOI comparison von Pelloie, J.L., Laplanche, Y., Chen, T.F., Huang, Y.T., Liu, P.W., Chiang, W.T., Huang, M.Y.T., Tsai, C.H., Cheng, Y.C., Tsai, C.T., Ma, G.H.

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Predicting L-band Microwave Attenuation through Forest Canopy using Directional Structuring Elements and Airborne Lidar von Wright, W.C., Liu, P.W., Slatton, K.C., Shrestha, R.L., Carter, W.E., Lee, H.

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Technology Roadmaps on the Ballistic Transport in Straln Engineered Nanoscale CMO0S Devices von Chung, S.S., Tsai, Y.J., Tsai, C.H., Liu, P.W., Lin, Y.H., Tsai, C.T., Ma, G.H., Chien, S.C., Sun, S.W.

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More strain and less stress- the guideline for developing high-end strained CMOS technologies with acceptable reliability von Chung, S.S., Hsieh, E.R., Huang, D.C., Lai, C.S., Tsai, C.H., Liu, P.W., Lin, Y.H., Tsai, C.T., Ma, G.H., Chien, S.C., Sun, S.W.

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Dopant and thermal interaction on SPE formed SiC for NMOS performance enhancement von Liu, P.W., Kuo, T.F., Li, C.I., Wang, Y.R., Huang, R.M., Tsai, C.H., Tsai, C.T., Ma, G.H.

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A distributed and interactive three-dimensional medical image system von Chen, L.S, Chen, J.P, Chen, S.C, Liu, P.W, Shyu, S.S

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