Processing and moisture effects on TDDB for Cu/ULK BEOL structures von Liniger, E.G., Shaw, T.M., Cohen, S.A., Leung, P.K., Gates, S.M., Bonilla, G., Canaperi, D.F., Rao, S. Papa

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Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures von LINIGER, E. G, DZIOBKOWSKI, C

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Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films von COOK, R. F, LINIGER, E. G

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Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics von Noyan, I. C., Wang, P.-C., Kaldor, S. K., Jordan-Sweet, J. L., Liniger, E. G.

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Delamination from Edge Flaws von Thouless, M. D., Jensen, H. M., Liniger, E. G.

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Kinetics of Indentation Cracking in Glass von Cook, Robert F., Liniger, Eric G.

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Effect of moisture on the time dependent dielectric breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric von Lloyd, J.R., Shaw, T.M., Liniger, E.G.

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A Controlled Flaw Technique for Lifetime Characterization von Liniger, Eric G., Cook, Robert E.

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Chip-Package-Interaction Modeling of Ultra Low-k/Copper Back End of Line von Liu, X.H., Shaw, T.M., Lane, M.W., Liniger, E.G., Herbst, B.W., Questad, D.L.

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Plane-strain, buckling-driven delamination of thin films: Model experiments and mode-II fracture von Thouless, M.D., Hutchinson, J.W., Liniger, E.G.

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Theory for Electromigration Failure in Cu Conductors von Lloyd, J. R., Murray, C. E., Shaw, T. M., Lane, M. W., Liu, X.-H., Liniger, E. G.

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Relationship between interfacial adhesion and electromigration in Cu metallization von Lloyd, J.R., Lane, M.W., Liniger, E.G.

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Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications von Hay, Jack C., Liniger, Eric G., Liu, Xiao Hu

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Kinetics of Indentation Cracking in Glass von Cook, R F, Liniger, E G

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Sigmoidal Indentation-Strength Characteristics of Polycrystalline Alumina von Cook, R F, Liniger, E G, Steinbrech, R W, Deuerler, F

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Phase Compatibilities in the System Y 2 O 3 ‐BaO‐CuO at 950°C von Frase, Katharine‐G., Liniger, E. G., Clarke, David R.

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Phase compatibilities in the system Y sub 2 O sub 3 -BaO-CuO at 950 degrees C von Frase, Katharine G, Liniger, E G, Clarke, David R

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Phase Compatibilities in the System Y2O3-BaO-CuO at 950°C von Frase, Katharine G, Liniger, E G, Clarke, David R

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Growth and configuration stability of circular, buckling-driven film delaminations von HITCHINSON, J. W, THOULESS, M. D, LINIGER, E. G

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Microstructure, impurity and metal cap effects on Cu electromigration von C-K, Hu, Gignac, L G, Ohm, J, Breslin, C M, Huang, E, Bonilla, G, Liniger, E, Rosenberg, R, Choi, S, Simon, A H

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