Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications von Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang

Volltext

Design optimization for micromachined low power Mach-Zehnder thermo-optic switch von Wu, Ching-Yi, Lin, Puru, Huang, Ruey-Shing, Chao, Wei-Chung, Lee, Mark M. H.

Volltext

Fabrication and Characterization of a Three-Dimensional Flexible Thermopile von Lin, Puru, Wu, Ching-Yi, Cheng, Yung-Ming, Lin, Yuh-Jiuan, Huang, Fon-Shan, Huang, Star Ruey-Shing

Volltext

Fan-Out Panel-Level Packaging of Mini-LED RGB Display von Lau, John H., Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien

Volltext

Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration von Lau, John H., Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, J. J., Huang, Patrick Po-Chun, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Lin, Eagle, Chang, Leo

Volltext

Panel-Level Chip-Scale Package With Multiple Diced Wafers von Lau, John H., Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Peng, Tony Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David

Volltext

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration von Lau, John H., Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Lu, Winnie

Volltext

Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration von Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie

Volltext

Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced Wafers von Lau, John H., Ko, Cheng-Ta, Tseng, Tzvy-Jang, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Cheng, David, Lu, Winnie

Volltext

Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs) von Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Fan, Yan-Jun, Cheng, David, Lu, Winnie

Volltext

Fine Trace Substrate with 2 μm Fine Line for Advanced Package von Hu, Dyi-Chung, Lin, Puru, Chen, Yu Hua

Volltext

High-Density Hybrid Substrate for Heterogeneous Integration von Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang

Volltext

Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration von Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.

Volltext

Design optimization for micromachined low power Mach-Zehnderthermo-optic switch von Wu, Ching-Yi, Lin, Puru, Huang, Ruey-Shing, Chao, Wei-Chung, Lee, Mark M. H.

Volltext

LIGHT-EMITTING DEVICE AND FORMATION METHOD THEREOF von PURU LIN

Volltext bestellen

LIGHTING DEVICE AND METHOD FOR FORMING THE SAME von LIN PURU

Volltext bestellen

Lighting device and method for forming the same von LIN, PURU

Volltext bestellen

Glass support plate protection structure and manufacturing method thereof von LIN PURU, LIN WENYU, YANG KAIMING

Volltext bestellen

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration von Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Lu, Winnie

Volltext

Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers von Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Lin, Curry, Cheng, David, Lu, Winnie

Volltext