Making lithography work for the 7-nm node and beyond in overlay accuracy, resolution, defect, and cost von Lin, Burn J.

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NGL comparable to 193-nm lithography in cost, footprint, and power consumption von Lin, Burn J.

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The ending of optical lithography and the prospects of its successors von Lin, Burn J.

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Optical lithography—present and future challenges von Lin, Burn J.

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The exposure-defocus forest von LIN, B. J

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The future of subhalf-micrometer optical lithography von Lin, Burn J.

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Can mems take advantage of advances in semiconductor lithography? von Lin, Burn J

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Optical lithography : present and future challenges: Ultimate lithography von LIN, Burn J

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A 90-nm CMOS device technology with high-speed, general-purpose, and low-leakage transistors for system on chip applications von Wu, C.C., Leung, Y.K., Chang, C.S., Tsai, M.H., Huang, H.T., Lin, D.W., Sheu, Y.M., Hsieh, C.H., Liang, W.J., Han, L.K., Chen, W.M., Chang, S.Z., Wu, S.Y., Lin, S.S., Lin, H.C., Wang, C.H., Wang, P.W., Lee, T.L., Fu, C.Y., Chang, C.W., Chen, S.C., Jang, S.M., Shue, S.L., Lin, H.T., See, Y.C., Mii, Y.J., Diaz, C.H., Lin, B.J., Liang, M.S., Sun, Y.C.

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Progress and outlook of lithography for semiconductor IC von Lin, B.J., Liu, R.G.

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Succeeding Optical Lithography with Multiple E-Beam Direct Write von Lin, Burn J.

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Nanolithography von Lin, Burn J.

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Critical dimension error analysis for 0.13 μm photolithography and beyond von Gau, Tsai-Sheng, Yen, Anthony, Chen, Jeng-Horng, Yu, Shinn-Sheng, Chen, Chun-Kuang, Ke, Chih-Ming, Lin, Burn J., Wang, Ping-Ting C.

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Lithography for manufacturing of sub-65nm nodes and beyond von Lin, B.J.

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Mask superposition for multiple exposures von LIN BURN J

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Apparatus and method for repairing resist latent images von LIN BURN J

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Apparatus and method for repairing resist latent images von Lin, Burn J

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Apparatus and method for repairing resist latent images von LIN BURN J

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Multiple mask step and scan aligner von Lin, Burn J

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Multiple mask step and scan aligner von LIN BURN J

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