Two cases of cutaneous eruptions due to CoVID‐19 infection in Singapore: new insights into the spectrum of clinical presentation and histopathology von Ho, W.Y.B, Wang, D., Tan, L.Y.C., Bundele, M.M., Tan, C.H., Lim, H.L.J.

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Epidemiology and prognostic factors for mycosis fungoides and Sézary syndrome in a multi‐ethnic Asian cohort: a 12‐year review von Lim, H.L.J., Tan, E.S.T., Tee, S.I., Ho, Z.Y., Boey, J.J.J., Tan, W.P., Tang, M.B.Y., Shen, L., Chan, Y.H., Tan, S.H.

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Vibration reliability characterization of PBGA assemblies von Yang, Q.J, Pang, H.L.J, Wang, Z.P, Lim, G.H, Yap, F.F, Lin, R.M

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Vibration fatigue test and analysis for flip chip solder joints von Che, F.X., Pang, H.L.J., Wong, F.L., Lim, G.H., Low, T.H.

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Interfacial fracture toughness test methodology for flip chip underfill encapsulant von Pang, H.L.J., Zhang, X.R., Lim, C.H., Shi, X.Q., Wang, Z.P.

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Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model von Shi, X.Q., Yang, Q.J., Wang, Z.P., Pang, H.L.J., Zhou, W.

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Methodology for a highly accelerated solder joint reliability test von Pang, H.L.J., Ang, K.H., Shi, X.Q., Wang, Z.P.

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Vibration reliability test of a PBGA assembly von Yang, Q.J., Lim, G.H., Pang, H.L.J., Wang, Z.P.

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Thermal stress analysis of direct chip attach electronic packaging assembly von Pang, H.L.J., Tan, T.I., Lim, G.Y., Wong, C.L.

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Experimental modal analysis of PBGA printed circuit board assemblies von Yang, Q.J., Lim, G.H., Lin, R.M., Yap, F.F., Pang, H.L.J., Wang, Z.P.

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