Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforceme... von Li, Yi, Luo, Kaiming, Lim, Adeline B.Y., Chen, Zhong, Wu, Fengshun, Chan, Y.C.

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Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition von Lim, Adeline B.Y., Neo, Wei Jian, Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

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Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing von Li, Yi, Lim, Adeline B.Y., Luo, Kaiming, Chen, Zhong, Wu, Fengshun, Chan, Y.C.

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Effect of palladium on the mechanical properties of Cu–Al intermetallic compounds von Lim, Adeline B.Y., Long, Xin, Shen, Lu, Chen, Xi, Ramanujan, R.V., Gan, Chee Lip, Chen, Zhong

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Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution von Lim, Adeline B.Y., Boothroyd, Chris B., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

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Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters von Lim, Adeline B.Y., Chang, Andrew C.K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

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Palladium-Coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding von Lim, Adeline B.Y., Chang, Andrew C.K., Lee, Chee Xian, Yauw, Oranna, Chylak, Bob, Chen, Zhong

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