Plasma application in atomic layer etching von Fischer, Andreas, Lill, Thorsten

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Plasma sources for advanced semiconductor applications von Versolato, Oscar, Kaganovich, Igor, Bera, Kallol, Lill, Thorsten, Lee, Hyo-Chang, Hoekstra, Ronnie, Sheil, John, Nam, Sang Ki

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Thermal etching of AlF3 and thermal atomic layer etching of Al2O3 von Fischer, Andreas, Routzahn, Aaron, Lee, Younghee, Lill, Thorsten, George, Steven M.

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Predicting synergy in atomic layer etching von Kanarik, Keren J., Tan, Samantha, Yang, Wenbing, Kim, Taeseung, Lill, Thorsten, Kabansky, Alexander, Hudson, Eric A., Ohba, Tomihito, Nojiri, Kazuo, Yu, Jengyi, Wise, Rich, Berry, Ivan L., Pan, Yang, Marks, Jeffrey, Gottscho, Richard A.

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Directional etch of magnetic and noble metals. II. Organic chemical vapor etch von Chen, Jack Kun-Chieh, Altieri, Nicholas D., Kim, Taeseung, Chen, Ernest, Lill, Thorsten, Shen, Meihua, Chang, Jane P.

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Ion Beam Patterning of High-Density STT-RAM Devices von Ip, Vincent, Shuogang Huang, Carnevale, Santino D., Berry, Ivan L., Rook, Katrina, Lill, Thorsten B., Paranjpe, Ajit P., Cerio, Frank

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Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing von Petit-Etienne, Camille, Darnon, Maxime, Vallier, Laurent, Pargon, Erwine, Cunge, Gilles, Boulard, François, Joubert, Olivier, Banna, Samer, Lill, Thorsten

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Highly Selective Directional Atomic Layer Etching of Silicon von Tan, Samantha, Yang, Wenbing, Kanarik, Keren J., Lill, Thorsten, Vahedi, Vahid, Marks, Jeff, Gottscho, Richard A.

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SiCl4/Cl2 plasmas: A new chemistry to etch high-k materials selectively to Si-based materials von Bodart, Paul, Cunge, Gilles, Joubert, Olivier, Lill, Thorsten

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Thermal Atomic Layer Etching of CoO, ZnO, Fe2O3, and NiO by Chlorination and Ligand Addition Using SO2Cl2 and Tetramethylethylenediamine von Partridge, Jonathan L., Murdzek, Jessica A., Johnson, Virginia L., Cavanagh, Andrew S., Fischer, Andreas, Lill, Thorsten, Sharma, Sandeep, George, Steven M.

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Effectiveness of Different Ligands on Silane Precursors for Ligand Exchange to Etch Metal Fluorides von Lii-Rosales, Ann, Johnson, Virginia L., Cavanagh, Andrew S., Fischer, Andreas, Lill, Thorsten, Sharma, Sandeep, George, Steven M.

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Materials science. The cutting edge of plasma etching von Lill, Thorsten, Joubert, Olivier

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Dry etching in the presence of physisorption of neutrals at lower temperatures von Lill, Thorsten, Berry, Ivan L., Shen, Meihua, Hoang, John, Fischer, Andreas, Panagopoulos, Theo, Chang, Jane P., Vahedi, Vahid

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Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride von Lill, Thorsten, Wang, Mingmei, Wu, Dongjun, Oh, Youn-Jin, Kim, Tae Won, Wilcoxson, Mark, Singh, Harmeet, Ghodsi, Vahid, George, Steven M., Barsukov, Yuri, Kaganovich, Igor

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Review on recent progress in patterning phase change materials von Shen, Meihua, Lill, Thorsten, Altieri, Nick, Hoang, John, Chiou, Steven, Sims, Jim, McKerrow, Andrew, Dylewicz, Rafal, Chen, Ernest, Razavi, Hamid, Chang, Jane P.

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Effect of surface polymerization on plasma and process stability in polycrystalline-silicon etching von Xu, Songlin, Lill, Thorsten, Deshmukh, Shashank, Joubert, Olivier

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The Cutting Edge of Plasma Etching von Lill, Thorsten, Joubert, Olivier

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Volatile Products from Ligand Addition of P(CH3)3 to NiCl2, PdCl2, and PtCl2: Pathway for Metal Thermal Atomic Layer Etching von Lii-Rosales, Ann, Johnson, Virginia L., Sharma, Sandeep, Fischer, Andreas, Lill, Thorsten, George, Steven M.

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(Invited) Etching of Advanced Semiconductor Devices von Lill, Thorsten

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TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR von Lill, Thorsten, Gregor, Mariusch

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