Coalescence Behavior of Gold Nanoparticles von Wang, Y. Q., Liang, W. S., Geng, C. Y.

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The presence probability of mandibular lingla and antilingula von Hsiao, S.-Y., Hsu, K.-J., Liang, S.-W., Tseng, Y.-C., Chen, C.-M.

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Exploring human biology with N-of-1 clinical trials von Schork, N J, Beaulieu-Jones, B, Liang, W S, Smalley, S, Goetz, L H

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A meta-analysis and systematic review of prophylactic endoscopic treatments for postpolypectomy bleeding von Li, L. Y., Liu, Q. S., Li, L., Cao, Y. J., Yuan, Q., Liang, S. W., Qu, C. M.

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Causes of ozone pollution in summer in Wuhan, Central China von Zeng, P., Lyu, X.P., Guo, H., Cheng, H.R., Jiang, F., Pan, W.Z., Wang, Z.W., Liang, S.W., Hu, Y.Q.

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Impact of laterally non-uniform carrier lifetime on photoconductance-based lifetime measurements with self-consistent calibration von Liang, W. S., Weber, Klaus J., Ren, Y. L.

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Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish von Chu, Ming-Hui, Liang, S.W., Chen, Chih, Huang, Annie T.

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Structural engineering of Ba0.5Sr0.5TiO3 epitaxial films von Wang, Y.Q., Liang, W.S., Kong, W.J., Petrov, Peter K., Alford, Neil M.

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Symmetrical transition of an atomic arrangement for 2D Bi films on Rh(111) von Yokoyama, M., Liang, W.S., Chen, W., Wee, A.T.S., Matsui, T., Yuhara, J.

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Electrical properties of atomic layer deposited Al2O3 with anneal temperature for surface passivation von Suh, D., Liang, W.S.

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Relieving hot-spot temperature and current crowding effects during electromigration in solder bumps by using Cu columns von LIANG, S. W, CHANG, Y. W, CHEN, Chih

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Electromigration issues in lead-free solder joints von Chen, Chih, Liang, S W

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Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints von Liang, S. W., Hsiao, H. Y., Chen, Chih

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Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing von LIANG, S. W, CHANG, Y. W, CHIH CHEN

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Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes von Chang, Y. W., Liang, S. W., Chen, Chih

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Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints von Liang, S. W., Hsiao, Hsiang-Yao, Chen, Chih, Xu, Luhua, Tu, K. N., Lai, Yi-Shao

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Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration von Liang, S.W., Chang, Y.W., Chen, Chih, Preciado, Jackie, Tu, K.N.

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Coalescence Behavior of Gold Nanoparticles von Wang, Y. Q, Liang, W. S, Geng, C. Y

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Geometrical effect of bump resistance for flip-chip solder joints : Finite-element modeling and experimental results von LIANG, S. W, CHANG, Y. W, CHEN, Chih, LIU, Y. C, CHEN, K. H, LIN, S. H

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Temperature and current-density distributions in flip-chip solder joints with Cu traces von HSU, C. Y, YAO, D. J, LIANG, S. W, CHEN, Chih, YEH, Everett C. C

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