A New Method to Induce Tensile Stress in Silicon on Insulator Substrate: From Material Analysis to Device Demonstration von Maitrejean, Sylvain, Loubet, Nicolas, Augendre, Emmanuel, Morin, Pierre Francois, Reboh, Shay, Bernier, Nicolas, Wacquez, Romain, Lherron, Benoit, Bonnevialle, Aurore, Liu, Qing, Hartmann, Jean-Michel, He, Hong, Halimaoui, Aomar, Li, Juntao, Pilorget, Sonia, Kanyandekwe, Joel, Grenouillet, Laurent, Chafik, Fadoua, Morand, Yves, Le Royer, Cyrille, Faynot, Oliver, Celik, Muhsin, Doris, Bruce, de Salvo, Barbara

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Converting SOI to sSOI through Amorphization and Crystallization: Material Analysis and Device Demonstration von Maitrejean, S., Loubet, N., Augendre, E., Morin, P., Reboh, S., Bernier, N., Wacquez, R., Lherron, B., Bonnevialle, A., Liu, Q., Hartmann, J. M., He, H., Halimaoui, A., Li, J., Pilorget, S., Kanyandekwe, J., Grenouillet, L., Chafik, F., Morand, Y., Royer, C. Le, Faynot, O., Celik, M., Doris, B., De Salvo, B.

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Impact of HF-based cleaning solutions on via resistance for sub-10nm BEOL structures von Peethala, B., Mont, F.W., Molis, S., Knarr, R., L'lherron, B., Labelle, C., Canaperi, D., Siddiqui, S.

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Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures von Peethala, B., Mont, F.W., Molis, S., Knarr, R., L'lherron, B., Labelle, C., Canaperi, D., Siddiqui, S.

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