Use of Multifunctional Carboxylic Acids and Hydrogen Peroxide To Improve Surface Quality and Minimize Phosphine Evolution During Chemical Mechanical Polishing of Indium Phosphide S... von Matovu, John B, Ong, Patrick, Leunissen, Leonardus H. A, Krishnan, Sitaraman, Babu, S. V

Volltext

Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide–based silica slurries containing oxalic acid or cit... von Matovu, John B., Ong, Patrick, Teugels, Lieve G., Leunissen, Leonardus H.A., Babu, S.V.

Volltext

Use of Surface Haze for Evaluation of Photoresist Residue Removal Efficiency von Halder, S., Vos, R., Masayuki, W., Kenis, K., Bearda, T., Radovanovic, S., Dighe, P., Leunissen, L.H.A., Mertens, P.W.

Volltext

Challenges with Respect to High-k/Metal Gate Stack Etching and Cleaning von Vos, Rita, Arnauts, Sophia, Bovie, Inge, Onsia, Bart, Garaud, Sylvain, Xu, Kaidong, Hongyu, Yu, Kubicek, Stefan, Rohr, Erika, Schram, Tom, Veloso, Anabela, Conard, Thierry, Leunissen, Leonardus H.A., Mertens, P.

Volltext

Correction of stray-light-induced proximity effect by complementary double exposure in microlithography von Kim, Young-Chang, De Bisschop, Peter, Leunissen, Leonardus H. A., Vandenberghe, Geert

Volltext

Damage Clustering and Damage-Size Distributions After Megasonic Cleaning von De Marco, Cinzia, Wostyn, Kurt L., Bearda, Twan, Sano, Ken-Ichi, Kenis, Karine, Janssens, Tom, Leunissen, Leonardus H.A., Eitoku, Atsuro, Mertens, P.

Volltext

Particle Removal from Micrometer-Sized Trenches Using High-Velocity-Aerosol Cleaning and Comparison with Megasonic Tank Cleaning von Wostyn, Kurt L., Sano, Ken-Ichi, Eitoku, Atsuro, Janssens, Tom, Bearda, Twan, Leunissen, Leonardus H.A., Mertens, P.

Volltext

Post Ion-Implant Photoresist Removal via Wet Chemical Cleans Combined with Physical Force Pretreatments von Totir, George G., Frank, Martin, Vos, Rita, Arnauts, Sophia, Bearda, Twan, Kenis, Karine, Delande, Martine, Le, QuocToan, Kesters, Els, Vereecke, Guy, Mannaert, Geert, Lux, Marcel, Hoflijk, Ilse, Conard, Thierry, Banerjee, Souvik, Malhouitre, Stephane, Leunissen, Leonardus H.A., Mertens, P.

Volltext

Influence of gate patterning on line edge roughness von Leunissen, Leonardus H. A., Jonckheere, Rik, Ronse, Kurt, Derksen, Giljam B.

Volltext

Particle Removal from Micron-Sized Trenches Using High-Velocity-Aerosol Cleaning and Comparison with Megasonic Tank Cleaning von Wostyn, Kurt L., Janssens, Tom, Bearda, Twan, Leunissen, Leonardus H.A., Mertens, P., Sano, Ken-Ichi, Eitoku, Atsuro

Volltext

Challenges with Respect to High-k/Metal Gate Stack Etching and Cleaning von Vos, Rita, Arnauts, Sophia, Bovie, Inge, Onsia, Bart, Garaud, Sylvain, Xu, Kaidong, Hongyu, Yu, Kubicek, Stefan, Rohr, Erika, Schram, Tom, Veloso, Anabela, Leunissen, Leonardus H.A., Mertens, P.

Volltext

Damage Clustering and Damage-Size Distributions After Megasonic Cleaning von De Marco, Cinzia, Wostyn, Kurt L., Bearda, Twan, Sano, Ken-Ichi, Kenis, Karine, Janssens, Tom, Leunissen, Leonardus H.A., Eitoku, Atsuro, Mertens, P.

Volltext

Post Ion-Implant Photoresist Removal for Front-End-Of-Line Applications von Totir, George G., Frank, Martin, Vos, Rita, Arnauts, Sophia, Bearda, Twan, Kenis, Karine, Delande, Martine, Le, QuocToan, Kesters, Els, Vereecke, Guy, Mannaert, Geert, Lux, Marcel, Hoflijk, Ilse, Conard, Thierry, Banerjee, Souvik, Malhouitre, Stephane, Leunissen, Leonardus H.A., Mertens, P.

Volltext

Wafer Backside Thinning Process Integrated with Post-Thinning Clean and TSV Exposure Recess Etch von Zhao, Ming, Hayakawa, Susumu, Nishida, Yoshiteru, Jourdain, Anne, Tabuchi, Tomotaka, Leunissen, Leonardus H.

Volltext

Cu/Low-k Thickness Measurement for Advanced Cu CMP Process Development and Control von Li, Yunlong, Heylen, Nancy, Delande, Tinne, Kellens, Kristof, Ong, Patrick, Leunissen, Leonardus, Tarnowka, Alexandre, Eliyahu, Aviv

Volltext