Use of Multifunctional Carboxylic Acids and Hydrogen Peroxide To Improve Surface Quality and Minimize Phosphine Evolution During Chemical Mechanical Polishing of Indium Phosphide S... von Matovu, John B, Ong, Patrick, Leunissen, Leonardus H. A, Krishnan, Sitaraman, Babu, S. V

Volltext

Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide–based silica slurries containing oxalic acid or cit... von Matovu, John B., Ong, Patrick, Teugels, Lieve G., Leunissen, Leonardus H.A., Babu, S.V.

Volltext

Use of Surface Haze for Evaluation of Photoresist Residue Removal Efficiency von Halder, S., Vos, R., Masayuki, W., Kenis, K., Bearda, T., Radovanovic, S., Dighe, P., Leunissen, L.H.A., Mertens, P.W.

Volltext

Influence of gate patterning on line edge roughness von Leunissen, Leonardus H. A., Jonckheere, Rik, Ronse, Kurt, Derksen, Giljam B.

Volltext

Correction of stray-light-induced proximity effect by complementary double exposure in microlithography von Kim, Young-Chang, De Bisschop, Peter, Leunissen, Leonardus H. A., Vandenberghe, Geert

Volltext

Wafer Backside Thinning Process Integrated with Post-Thinning Clean and TSV Exposure Recess Etch von Zhao, Ming, Hayakawa, Susumu, Nishida, Yoshiteru, Jourdain, Anne, Tabuchi, Tomotaka, Leunissen, Leonardus H.

Volltext

Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and 1/2 Pitch Lines: From Coupon to Full-Wafer Experiments von Armini, Silvia, Demuynck, Steven, El-mekki, Zaid, Swerts, Johan, Nagar, Magi, Radisic, Alex, Heylen, Nancy, Beyer, Gerald, Leunissen, Leonardus, Vereecken, Philippe

Volltext