Treffer 1 - 3 von 3 für Suche 'Leong Jenn Seong', Suchdauer: 0,24s Treffer weiter einschränken
  1. 1
    Investigation of solder bridging failure for molded matrix array package

    Investigation of solder bridging failure for molded matrix array package von Chong Kim Foong, Wong Shaw Fong, Leong Jenn Seong, He Yi, Lee Chee Kan, Kim Kay


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  2. 2
    Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA)

    Compressive Load Challenges on Sub 1.00 Ball Pitch for Flip Chip Ball Grid Array (FCBGA) von Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aim Tan

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  3. 3
    Influence of Package Assembly Process on Solder Joint Reliability - an Application of Component Level Shock Methodology

    Influence of Package Assembly Process on Solder Joint Reliability - an Application of Component Level Shock Methodology von Lee Yung Hsiang, Loh Wei Keat, Ee Boon Yee, Leong Jenn Seong, Lew Huey Ling

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