Treffer 1 - 5 von 5 für Suche 'Lei, Thomas Guangyin', Suchdauer: 0,38s Treffer weiter einschränken
  1. 1
    A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module

    A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module von Puqi Ning, Lei, Thomas Guangyin, Fei Wang, Guo-Quan Lu, Ngo, Khai D T, Rajashekara, Kaushik


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  2. 2
    Edge tail length effect on reliability of DBC substrates under thermal cycling

    Edge tail length effect on reliability of DBC substrates under thermal cycling von Dong, Guangcheng, Lei, Guangyin (Thomas), Chen, Xu, Ngo, Khai, Lu, Guo-Quan


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  3. 3
    Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (100~^) Chips

    Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (100~^) Chips von Lei, Thomas Guangyin, Calata, Jesus Noel, Lu, Guo-Quan, Chen, Xu, Luo, Shufang


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  4. 4
    Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

    Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement von Li Jiang, Lei, Thomas Guangyin, Ngo, Khai D. T., Guo-Quan Lu, Shufang Luo


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  5. 5
    Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate

    Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate von Guangyin Lei, T., Calata, J.N., Ngo, K.D.T., Guo-Quan Lu


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